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Chemically Resistant adhesives

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ITW Insulcast® 3230 LV Epoxy Potting/Encapsulation Compound
Categories: Polymer; Thermoset; Epoxy

Material Notes: Insulcast® solutions are compounds designed for potting and encapsulating. INSULCAST 3230 LV is a low viscosity, highly filled epoxy formulation which, in addition to having excellent electrical properties, has unusually high thermal conductivity with low thermal expansion. Similar to INSULCAST 140 but lower viscosity. This system meets the NASA out gassing specifications with tolerances for TML ranging from 0.40 to 0.41% and for CVCM ranging from 0.0 to 0.1%.

Information provided by ITW Performance Polymers.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 0.950 g/ccUncured. Insulcure 11B
 0.970 g/ccUncured. Insulcure 9
 2.10 g/ccUncured. Insulcast 3230 LV
Viscosity 55 cPInsulcure 9; ASTM D2392
 700 cPInsulcure 11B; ASTM D2392
 6000 cPUncured, mix. Insulcure 9; ASTM D2392
 12000 cPUncured, mix. Insulcure 11B; ASTM D2392
 18000 cPInsulcast 3230 LV; ASTM D2392
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 90cured. Insulcure 9; ASTM D2240
 92cured. Insulcure 11B; ASTM D2240
Tensile Strength 8000 psicured. Insulcure 9; ASTM D638
 8500 psicured. Insulcure 11B; ASTM D638
Elongation at Break 1.0 %Cured. Insulcure 11B; ASTM D638
 1.0 %Cured. Insulcure 9; ASTM D638
Flexural Strength 13000 psiCured. Insulcure 9; ASTM D790
 13500 psiCured. Insulcure 11B; ASTM D790
Compressive Strength 16500 psiCured. Insulcure 9; ASTM D790
 18000 psiCured. Insulcure 11B; ASTM D790
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.30e+16 ohm-cmInsulcure 9; ASTM D257
 5.00e+16 ohm-cmInsulcure 11B; ASTM D257
Dielectric Constant 6.3
@Frequency 1000 Hz
Insulcure 9; ASTM D150
 6.5
@Frequency 1000 Hz
Insulcure 11B; ASTM D150
Dielectric Strength 475 V/milInsulcure 9; ASTM D149
 500 V/milInsulcure 11B; ASTM D149
Dissipation Factor 0.020
@Frequency 1000 Hz
Insulcure 11B; ASTM D150
 0.020
@Frequency 1000 Hz
Insulcure 9; ASTM D150
 
Thermal PropertiesOriginal ValueComments
CTE, linear 28.0 µm/m-°CCured. Insulcure 11B
 28.0 µm/m-°CCured. Insulcure 9
Thermal Conductivity 0.900 - 1.10 W/m-Kcured. Insulcure 9
 0.900 - 1.10 W/m-Kcured. Insulcure 9
Maximum Service Temperature, Air 105 °CInsulcure 9
 155 °CInsulcure 11B
Heat Distortion Temperature 80.0 °CLoad Not Reported. Insulcure 9
 150 °CLoad Not Reported. Insulcure 11B
Minimum Service Temperature, Air -55.0 °CCured. Insulcure 11B
 -40.0 °CCured. Insulcure 9
 
Processing PropertiesOriginal ValueComments
Pot Life 75.0 - 120 min
@Temperature 25.0 °C
Insulcure 9.100 grams
 150 - 180 min
@Temperature 25.0 °C
Insulcure 11B. 100 grams
Shelf Life 12.0 MonthInsulcast 3230 LV. 100 grams
 12.0 MonthInsulcure 11B. 100 grams
 12.0 MonthInsulcure 9. 100 grams
 
Descriptive Properties
ColoramberUncured. Insulcure 9
 amberUncured. Insulcure 11B
 blackInsulcast 3230 LV
Mix Ratio by weight100:4-53230 LV:Insulcure 9
 100:5-73230 LV:Insulcure 11B

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PITWIN9106 / 239616

Chemically Resistant adhesives

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