Cookson Group Plaskon® SMT-B-1RC (146.403) Epoxy Molding Compound for PBGAs

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Cookson Group Plaskon® SMT-B-1RC (146.403) Epoxy Molding Compound for PBGAs (discontinued **)
Categories:	Polymer; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	Test specimens were transfer molded and post cured 4 hours at 175°C. An epoxy molding compound optimized specifically for PBGA applications. It has the same unique resin system as SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Faster cure speed for shorter cure times in multi-plunger and automolding equipment; Improved wire sweep performance (lower viscosity); Reduced post mold cure times; Improved warp performance
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Physical Properties	Original Value	Comments

Density	1.88 g/cc
Viscosity	6000 cP @Temperature 175 °C	Shimadzu Viscosity, 1000 psi
Spiral Flow	90.0 cm	175°C/1000 psi

Mechanical Properties	Original Value	Comments
Hardness, Shore D	83
Flexural Strength	68.0 MPa
Flexural Modulus	13.0 GPa

Electrical Properties	Original Value	Comments
Electrical Resistivity	2.00e+16 ohm-cm
Dielectric Constant	3.9 @Frequency 1000 Hz
Dielectric Strength	28.0 kV/mm

Thermal Properties	Original Value	Comments
CTE, linear	14.0 µm/m-°C @Temperature 20.0 °C
CTE, linear, Transverse to Flow	56.0 µm/m-°C @Temperature 20.0 °C
Thermal Conductivity	0.700 W/m-K
Glass Transition Temp, Tg	225 °C
Flammability, UL94	V-0 @Thickness 3.20 mm
	V-0 @Thickness 3.20 mm

Processing Properties	Original Value	Comments
Processing Temperature	170 - 185 °C	Molding temperature

**
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PCOOK333 / 21429

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