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Ensinger PEI

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Henkel Loctite® ECCOBOND UF 3820 Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Black liquid

Cure: Heat cure

Product Benefits:

  • High Tg
  • Easy rework
  • Halogen free
  • One component
  • Fast cure at moderate temperatures
  • Room temperature flow capability
  • High fracture toughness
  • Excellent thermal cycle performance
  • Compatible with most Pb-free solders
  • Stable electrical performance under thermal/humidity bias
Application: Underfill

Typical Package Application: CSP, WLCSP and BGA

LOCTITE ECCOBOND UF 3820 reworkable underfill is specially designed for CSP, WLCSP and BGA applications. It is formulated to cure quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling.

Information provided by Loctite®

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.24 g/cc
Brookfield Viscosity 340 cP
@Shear Rate 1000 1/s
CP50-1
 
Mechanical PropertiesOriginal ValueComments
Tensile Modulus 25.0 MPa
@Temperature 200 °C
Storage, Cured, DMA
 50.0 MPa
@Temperature 150 °C
Storage, Cured, DMA
 2070 MPa
@Temperature 100 °C
Storage, Cured, DMA
 2560 MPa
@Temperature 25.0 °C
Storage, Cured, DMA
Fracture Toughness 1.50 MPa-m½Instron
Shear Strength 10.9 MPaPCB to PCB
 
Electrical PropertiesOriginal ValueComments
Dielectric Constant 2.93
@Frequency 5.00e+9 Hz
 2.94
@Frequency 8.50e+8 Hz
 2.96
@Frequency 2.50e+9 Hz
 3.02
@Frequency 1.575e+9 Hz
Dissipation Factor 0.047
@Frequency 2.50e+9 Hz
 0.048
@Frequency 8.50e+8 Hz
 0.052
@Frequency 1.575e+9 Hz
 0.052
@Frequency 5.00e+9 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 51.0 µm/m-°CCured, Below Tg
 172 µm/m-°CCured, Above Tg
Glass Transition Temp, Tg 133 °CCured, by TMA
 
Processing PropertiesOriginal ValueComments
Cure Time 3.00 min
@Temperature 160 °C
Alternate Cure Schedule
 5.00 min
@Temperature 150 °C
Alternate Cure Schedule
 10.0 min
@Temperature 130 °C
Working Life 24.0 hourWorklife, 25% change in viscosity
Shelf Life 6.00 Month
@Temperature -40.0 °C
 
Descriptive Properties
Thixotropic Index1.1Uncured

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