Appearance: Black liquid Cure: Heat cure Product Benefits: - High Tg
- Easy rework
- Halogen free
- One component
- Fast cure at moderate temperatures
- Room temperature flow capability
- High fracture toughness
- Excellent thermal cycle performance
- Compatible with most Pb-free solders
- Stable electrical performance under thermal/humidity bias
Application: Underfill Typical Package Application: CSP, WLCSP and BGA LOCTITE ECCOBOND UF 3820 reworkable underfill is specially designed for CSP, WLCSP and BGA applications. It is formulated to cure quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling. Information provided by Loctite® |