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Chemically Resistant adhesives

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Aptek 3101 B/C/B Thermally conductive urethane film adhesive
Categories: Polymer; Adhesive; Thermoset; Polyurethane, TS; Thermoset Polyurethane, Adhesive

Material Notes: Thermally conductive, electrically insulating hybrid urethane film adhesive
APTEK 1301 B/C/B is a low modulus, flexible, void free, electrically insulating hybrid urethane film adhesive designed to bond dissimilar components and substrates. This B/C/B system is designed to manage stresses developed from mismatches of thermal expansion coefficients during temperature cycling as well as to dissipate heat generated from components and circuitry. APTEK 1301 B/C/B technology incorporates a partially-cured (B-staged) adhesive on both faces of a fully-cured (C-staged) ultra low modulus film. APTEK 1301 B/C/B film is a 100% solids, thermoset polymer, which will not outgas, while in place and is suitable for high vacuum environments. The film exhibits outstanding reversion resistance and physical stability under long-term aging of high humidity and heat.

Low modulus/high elongation for minimum stress to sensitive components and ceramic substrates; Low Tg-remains flexible to -75ºC; Exceeds NASA outgassing requirements for high vacuum environments; Typical film thickness, .006" to .012"; Available in sheet or die-cut forms; Low tack adhesive layer allows for easy placement and, if needed, repositioning on assemblies

Information provided by Aptek Laboratories, Inc.

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Physical PropertiesOriginal ValueComments
Density 1.96 g/ccASTM D1475
Moisture Absorption at Equilibrium 0.15 %Cured property; ASTM D570
Outgassing - Total Mass Loss 0.50 %Cured property; at 10E-6 torr; ASTM E595
Collected Volatile Condensable Material 0.040 %Cured property; at 10E-6 torr; ASTM E595
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength, Ultimate 300 psi
@Thickness 0.203 mm
Cured; ASTM D638
Elongation at Break 70 %
@Thickness 0.203 mm
Cured; ASTM D638
Tensile Modulus 550 psi
@Thickness 0.127 mm
Cured; ASTM D638
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 7.00e+14 ohm-cmCured property; ASTM D257
Dielectric Constant 5.8
@Frequency 1000 Hz
Cured property; ASTM D150
Dielectric Strength 1000 V/mil
@Thickness 0.127 mm
Cured; ASTM D149
Dissipation Factor 0.030
@Frequency 1000 Hz
Cured property; ASTM D150
 
Thermal PropertiesOriginal ValueComments
CTE, linear 40.0 µm/m-°C
@Temperature 20.0 °C
Cured property; alpha 1
 160 µm/m-°C
@Temperature 20.0 °C
Cured property; alpha 2
Thermal Conductivity 0.800 W/m-K
Glass Transition Temp, Tg -75.0 °CCured property; ASTM E831-86
 
Processing PropertiesOriginal ValueComments
Processing Temperature 85.0 °CCure 4 hrs
 100 °CCure 2 hrs
 125 °CCure 1 hrs

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PAPTEK21 / 24183

Chemically Resistant adhesives

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