Henkel Loctite® ABLESTIK 968-2 Epoxy

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Henkel Loctite® ABLESTIK 968-2 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Blue paste Cure: Heat cure Product Benefits: Electrically insulating Proprietary hybrid chemistry Application: Die attach LOCTITE ABLESTIK 968-2 die attach adhesive is designed for microelectronic chip bonding applications. This adhesive is ideal for application by syringe dispensing or screen printing. Information provided by Loctite®
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Physical Properties	Metric	English	Comments

Viscosity	45000 cP	45000 cP	Uncured

Mechanical Properties	Metric	English	Comments
Shear Strength	37.2 MPa	5400 psi	Die, 80 mil² (2.03 mm²) die: Au to Au

Electrical Properties	Metric	English	Comments
Volume Resistivity	4.00e+14 ohm-cm	4.00e+14 ohm-cm
Dielectric Constant	4.17 @Frequency 1000 Hz	4.17 @Frequency 1000 Hz
Dissipation Factor	0.049 @Frequency 1000 Hz	0.049 @Frequency 1000 Hz

Thermal Properties	Metric	English	Comments
CTE, linear	35.0 µm/m-°C	19.4 µin/in-°F	Cured, Below Tg
	100 µm/m-°C	55.6 µin/in-°F	Cured, Above Tg
Thermal Conductivity	0.865 W/m-K	6.00 BTU-in/hr-ft²-°F	Cured
Glass Transition Temp, Tg	139 °C	282 °F	Cured

Processing Properties	Metric	English	Comments
Cure Time	120 min @Temperature 150 °C	2.00 hour @Temperature 302 °F
Working Life	5760 min	5760 min
Shelf Life	3.00 Month @Temperature 5.00 °C	3.00 Month @Temperature 41.0 °F
	6.00 Month @Temperature -10.0 °C	6.00 Month @Temperature 14.0 °F
	12.0 Month @Temperature -40.0 °C	12.0 Month @Temperature -40.0 °F

Descriptive Properties
Extractable Ionic Content (ppm)	15		Cured, Sodium (Na+)
	215		Cured, Chloride (Cl-)
	30		Cured, Potassium (K+)
Water Extract Conductivity	24 µmhos/cm		Cured
Weight Loss (%)	0.12		300°C

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PLOCT5112 / 255323

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