Parker Chomerics CHO-BOND® 360-208 Conductive Epoxy

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Parker Chomerics CHO-BOND® 360-208 Conductive Epoxy
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive
Material Notes:	Low cost, electrically conductive epoxy adhesive that combines the good adhesive characteristics as epoxy, and the superior electrical conductivity of silver. It is recommended as a thermo-setting EMI/RFI shielding compound and is effective even for designs requiring the use of a fillet as opposed to a flanged bead. Applications: Typically include sealing EMI/RFI leaks around vents, windows, and machined surfaces; the bonding and shielding of conduit bulkhead passthroughs. Information provided by Chomerics
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Physical Properties	Metric	English	Comments

Specific Gravity	3.60 - 4.40 g/cc	3.60 - 4.40 g/cc
Volatile Organic Compounds (VOC) Content	0.00 g/l	0.00 g/l
Thickness	>= 254 microns	>= 10.0 mil

Mechanical Properties	Metric	English	Comments
Shear Strength	9.65 MPa @Temperature 100 °C, Time 2700 sec	1400 psi @Temperature 212 °F, Time 0.750 hour	Lap

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.010 ohm-cm @Temperature 100 °C, Time 2700 sec	<= 0.010 ohm-cm @Temperature 212 °F, Time 0.750 hour

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	100 °C	212 °F
Minimum Service Temperature, Air	-62.0 °C	-79.6 °F

Processing Properties	Metric	English	Comments
Cure Time	15.0 min @Temperature 115 °C	0.250 hour @Temperature 239 °F
	45.0 min @Temperature 100 °C	0.750 hour @Temperature 212 °F
	60.0 min @Temperature 95.0 °C	1.00 hour @Temperature 203 °F
	120 min @Temperature 66.0 °C	2.00 hour @Temperature 151 °F
	1440 min @Temperature 24.0 °C	24.0 hour @Temperature 75.2 °F
Pot Life	60 min	60 min
Shelf Life	9.00 Month	9.00 Month

Descriptive Properties
Binder	Epoxy
Consistency	Thick Paste
Coverage	9.9 cm² / g
Filler	Ag/Cu, Ag
Mix Ratio	100:33
Working Life	1 hr

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PCHOME056 / 28278

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