Cookson Group Plaskon® MUF-2C Molded Underfill Compound for Flip Chip BGAs and CSPs

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Cookson Group Plaskon® MUF-2C Molded Underfill Compound for Flip Chip BGAs and CSPs (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material’s higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON MUF Series is the total molded underfill solution for Flip Chip in Package. Features: Higher productivity Higher Tg Higher reliability Lower warpage Lower CTE Lower cost of ownership Minimum 220°C reflow Minimum JEDEC Level 3 Applications: PLASKON CMU-870-2C Molded Underfill is suitable for high volume underfill and overmold protection of Flip Chip BGA and CSP packages. It is suitable for stack die packages using a combination of wirebonded and flip chip dies wh
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Physical Properties	Original Value	Comments

Specific Gravity	1.89 g/cc
Viscosity	4200 cP @Temperature 175 °C	Shimadzu Viscosity, 1000 psi
Spiral Flow	115 cm	at 175°C and 1000 psi
Ash	81 %
Storage Temperature	<= 5.00 °C	Recommended

Mechanical Properties	Original Value	Comments
Hardness, Shore D	77	Cull hot
Flexural Strength	14220 psi
	5404.9 psi @Temperature 260 °C
Flexural Modulus	2.062e+6 psi
	1.072e+6 psi @Temperature 215 °C

Electrical Properties	Original Value	Comments
Volume Resistivity	4.50e+15 ohm-cm
Dielectric Constant	3.13 @Frequency 1000 Hz
Dielectric Strength	>= 800 V/mil
Dissipation Factor	0.0017 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	13.0 µm/m-°C @Temperature 20.0 °C	Alpha 1
	60.0 µm/m-°C @Temperature 20.0 °C	Alpha 2
Thermal Conductivity	0.700 W/m-K
Glass Transition Temp, Tg	194 °C
Flammability, UL94	V-0 @Thickness 3.17 mm

Processing Properties	Original Value	Comments
Mold Temperature	165 - 185 °C
Back Pressure	600 - 1200 psi
Cure Time	50.0 - 150 sec	In mold
	0.000 - 2.00 hour @Temperature 175 °C	Post mold
Gel Time	0.250 min	Ram follower, at 175°C and 1000 psi
Shelf Life	0.0670 Month	at 35°C, <40% loss of spiral flow
	0.200 Month	at 22°C, <40% loss of spiral flow
	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Halides	<1 ppm

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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PPLASK035 / 56325

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