Cookson Group Plaskon® SMT-B-1LV Molding Compound for PBGAs

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Cookson Group Plaskon® SMT-B-1LV Molding Compound for PBGAs (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy molding compound designed specifically for grid arrays (BGA/LGA). Using an improved optimized filler system, it provides a lower viscosity with higher flow characteristics than SMT-B- 1. It is formulated with a unique resin system, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for grid arrays. Features: Improved wire sweep performance Low stress Minimal warpage Outstanding high temperature flexural strength Information provided by Cookson Electronics
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Physical Properties	Original Value	Comments

Specific Gravity	1.88 g/cc
Viscosity	5000 cP @Temperature 175 °C	Shimadzu Viscosity, 1000 psi
Spiral Flow	130 cm	at 175°C and 1000 psi
Ash	77.4 %
Storage Temperature	<= 5.00 °C	Recommended

Mechanical Properties	Original Value	Comments
Hardness, Shore D	72	Cull hot
Flexural Strength	14370 psi
	5973.8 psi @Temperature 215 °C
Flexural Modulus	1.792e+6 psi
	867600 psi @Temperature 215 °C

Electrical Properties	Original Value	Comments
Volume Resistivity	3.20e+12 ohm-cm @Temperature 150 °C
	1.80e+16 ohm-cm @Temperature 22.0 °C
Dielectric Constant	4.0 @Frequency 1000 Hz
Dielectric Strength	700 V/mil

Thermal Properties	Original Value	Comments
CTE, linear	14.0 µm/m-°C @Temperature 20.0 °C	Alpha 1
	58.0 µm/m-°C @Temperature 20.0 °C	Alpha 2
Thermal Conductivity	0.700 W/m-K
Glass Transition Temp, Tg	225 °C
Flammability, UL94	V-0 @Thickness 3.17 mm
Oxygen Index	32 %

Processing Properties	Original Value	Comments
Mold Temperature	170 - 185 °C
Back Pressure	750 - 1250 psi
Cure Time	120 - 180 sec	In mold
	4.00 - 6.00 hour @Temperature 175 °C	Post mold
Gel Time	0.317 min	Ram follower, at 175°C and 1000 psi
Shelf Life	0.100 Month	at 35°C, <40% loss of spiral flow
	0.250 Month	at 21°C, <40% loss of spiral flow
	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Halides	<1 ppm

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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PPLASK001 / 56291

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