Cookson Group Plaskon® NXG-1 Molding Compound for PBGAs

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Cookson Group Plaskon® NXG-1 Molding Compound for PBGAs (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy molding compound for high temperature, lead-free reflow. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, hybrid resin developed to pass JEDEC Level 2A at 260°C IR reflow temperature. It is a “green” compound with no halogens and a lower Tg than multifunctional materials. Features: Very low moisture pickup Good moldability No halogens "green" Fast cure Information provided by Cookson Electronics
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Physical Properties	Original Value	Comments

Specific Gravity	2.00 g/cc
Moisture Absorption at Equilibrium	0.265 %	at 85°C/85% RH, 168 hours
Viscosity	4000 cP @Temperature 175 °C	Shimadzu Viscosity, 1000 psi
Spiral Flow	140 cm	at 175°C and 1000 psi
Ash	88.6 %
Storage Temperature	<= 5.00 °C	Recommended

Mechanical Properties	Original Value	Comments
Hardness, Shore D	75	Cull hot
Flexural Strength	18060 psi
	1180.5 psi @Temperature 260 °C
Flexural Modulus	3.698e+6 psi
	99560 psi @Temperature 260 °C

Thermal Properties	Original Value	Comments
CTE, linear	8.90 µm/m-°C @Temperature 20.0 °C	Alpha 1
	36.0 µm/m-°C @Temperature 20.0 °C	Alpha 2
Thermal Conductivity	0.700 W/m-K
Glass Transition Temp, Tg	140 °C
Flammability, UL94	V-0 @Thickness 3.17 mm

Processing Properties	Original Value	Comments
Mold Temperature	165 - 185 °C
Back Pressure	1000 psi
Cure Time	50.0 - 100 sec	In mold
	0.000 - 2.00 hour @Temperature 175 °C	Post mold
Gel Time	0.300 min	Ram follower, at 175°C and 1000 psi
Shelf Life	0.0167 Month	at 35°C, <40% loss of spiral flow
	0.0670 Month	at 22°C, <40% loss of spiral flow
	6.00 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Halides	<1 ppm

**
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PPLASK011 / 56301

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