Rogers Arlon CLTE-P Pre-Preg Bonding Layer

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Rogers Arlon CLTE-P Pre-Preg Bonding Layer
Categories:	Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE)
Material Notes:	Arlon's CLTE-P Prepreg Bonding Layer is a ceramic filled PTFE coated glass stock that is used as a bonding ply for CLTE, CLTE-X or CLTE-AT laminates. CLTE-P is a pre-preg material that consists of woven fiberglass fabric coated with a proprietary resin formulation. The Proprietary resin is thermoplastic, not thermoset in nature. Information provided by Arlon Materials for Electronics (MED); now a part of Rogers Corporation.
Vendors:	Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets. Click here to view all available suppliers for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
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Physical Properties	Original Value	Comments

Density	2.38 g/cc	ASTM D792 Method A
Water Absorption	0.040 %	IPC TM-650 2.6.2.2
Thickness	0.00240 mil	After lamination
	0.00320 mil	As received
	0.0620 mil	Thickness of laminate tested
Outgassing - Total Mass Loss	0.00 % @Pressure <=1.33e-10 MPa, Temperature 125 °C	Water Vapor Recovered; NASA SP-R-0022A
	0.020 % @Pressure <=1.33e-10 MPa, Temperature 125 °C	NASA SP-R-0022A
Collected Volatile Condensable Material	0.00 % @Pressure <=1.33e-10 MPa, Temperature 125 °C	NASA SP-R-0022A

Mechanical Properties	Original Value	Comments
Tensile Strength	7000 psi	Cross; ASTM D882
	8200 psi	Machine; ASTM D882
Modulus of Elasticity	462 ksi	Cross; ASTM D638
	471 ksi	Machine; ASTM D638
Flexural Modulus	>= 375 ksi	ASTM D790
Compressive Modulus	225 ksi	ASTM D695
Peel Strength	7.00 pli	After Thermal Stress; IPC TM-650 2.4.8

Electrical Properties	Original Value	Comments
Volume Resistivity	1.40e+14 ohm-cm	C96/35/90; IPC TM-650 2.5.17.1
Surface Resistance	1.30e+12 ohm	C96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant	2.94 @Frequency 1e+10 Hz	C23/50; IPC TM-650 2.5.5.5
Dielectric Breakdown	>= 45000 V	D48/50; ASTM D149
Dissipation Factor	0.0025 @Frequency 1e+10 Hz	C23/50; IPC TM-650 2.5.5.5
Arc Resistance	>= 180 sec	D48/50; ASTM D495

Thermal Properties	Original Value	Comments
CTE, linear	10.0 µm/m-°C @Temperature 0.000 - 100 °C	x direction; IPC TM-650 2.4.24
	12.0 µm/m-°C @Temperature 0.000 - 100 °C	y direction; IPC TM-650 2.4.24
CTE, linear, Transverse to Flow	35.0 µm/m-°C @Temperature 0.000 - 100 °C	z direction; IPC TM-650 2.4.24
Thermal Conductivity	0.500 W/m-K @Temperature 100 °C	ASTM E1225
Flammability, UL94	V-0	Vertical Burn

Descriptive Properties
Temperature Coefficient of Dielectric (ppm/°C)	-12	IPC TM-650 2.5.5.5 (-10 - 140°C)

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

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PARLM9895 / 149048

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