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Ensinger SPI

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SABIC LNP™ THERMOCOMP™ Compound GZ004 Polysulfone (PSU)
Categories: Polymer; Thermoplastic; Polysulfone (PSU)

Material Notes: LNP THERMOCOMP GZ004 compound is based on Polysulfone (PSU) resin containing 20% milled glass.

Features: Low Warpage,Structural

Information provided by SABIC

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Physical PropertiesOriginal ValueComments
Density 1.35 g/ccISO 1183
Moisture Absorption <= 0.0500 %Injection Molding
Moisture Absorption at Equilibrium 0.10 - 0.30 %23°C/50% RH; ISO 62-4
Water Absorption at Saturation 0.50 - 0.60 %ISO 62-1
Linear Mold Shrinkage, Flow 0.0050 - 0.0070 cm/cmSABIC method
Linear Mold Shrinkage, Transverse 0.0040 - 0.0060 cm/cmSABIC method
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength, Yield 57.0 MPa5 mm/min; ISO 527
Elongation at Break 5.0 %5 mm/min; ISO 527
Elongation at Yield 3.6 %5 mm/min; ISO 527
Tensile Modulus 3700 MPa1 mm/min; ISO 527
Flexural Strength 104 MPabreak, 2mm/min; ISO 178
Flexural Modulus 3600 MPa2 mm/min; ISO 178
Izod Impact, Notched (ISO) 5.00 kJ/m²80*10*4; ISO 180/1A
Izod Impact, Unnotched (ISO) 40.0 kJ/m²80*10*4; ISO 180/1U
Charpy Impact Unnotched 55.0 kJ/m²Edgew 80*10*4 sp=62mm; ISO 179/1eU
Charpy Impact, Notched 7.00 kJ/m²Edgew 80*10*4 sp=62mm; ISO 179/1eA
 
Thermal PropertiesOriginal ValueComments
CTE, linear, Parallel to Flow 49.0 µm/m-°C
@Temperature -40.0 - 40.0 °C
ASTM E831
CTE, linear, Transverse to Flow 52.0 µm/m-°C
@Temperature -40.0 - 40.0 °C
ASTM E831
Deflection Temperature at 0.46 MPa (66 psi) 181 °CFlatw 80*10*4 sp=64mm; ISO 75/Bf
Deflection Temperature at 1.8 MPa (264 psi) 170 °CFlatw 80*10*4 sp=64mm; ISO 75/Af
Vicat Softening Point 186 °CRate B/50; ISO 306
Flammability, UL94 V-2
@Thickness 1.50 mm
UL 94
 
Processing PropertiesOriginal ValueComments
Nozzle Temperature 340 - 370 °C
Zone 2 340 - 350 °C
Zone 3 350 - 360 °C
Melt Temperature 360 - 370 °CInjection Molding
Mold Temperature 150 °C
Drying Temperature 120 - 150 °CInjection Molding
Dry Time 4.00 hourInjection Molding
Back Pressure 0.200 - 0.300 MPa

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PSABH81609 / 289556

Ensinger SPI

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