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USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

Covestro Bayblend® M850 XF PC/ABS Blend
Categories: Polymer; Thermoplastic; ABS Polymer; Polycarbonate/ABS Alloy, Unreinforced; Polycarbonate (PC)
Material Notes: (PC+ABS)-Blend; easy flowing; Vicat/B 120 temperature = 131 °C; meet certain requirements of ISO Standard 10993-1

As of 1 September 2015, Bayer MaterialScience was separated from Bayer AG and officially adopted its new name – Covestro.
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.14 g/cc0.0412 lb/in³ISO 1183-1
Moisture Absorption at Equilibrium 0.20 %0.20 %ISO 62, 50% RH
Water Absorption at Saturation 0.70 %0.70 %ISO 62
Viscosity 210000 cP
@Shear Rate 1000 1/s,
Temperature 260 °C		210000 cP
@Shear Rate 1000 1/s,
Temperature 500 °F		melt viscosity; b.o. ISO 11443-A
Linear Mold Shrinkage, Flow 0.0055 - 0.0075 cm/cm
@Thickness 3.00 mm		0.0055 - 0.0075 in/in
@Thickness 0.118 in		150x105x3mm; b.o. ISO 2577
Linear Mold Shrinkage, Transverse 0.0055 - 0.0075 cm/cm
@Thickness 3.00 mm		0.0055 - 0.0075 in/in
@Thickness 0.118 in		150x105x3mm; b.o. ISO 2577
Melt Flow 27.36 g/10 min
@Load 5.00 kg,
Temperature 260 °C		27.36 g/10 min
@Load 11.0 lb,
Temperature 500 °F		ISO 1133
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength at Break 53.0 MPa7690 psi50 mm/min; ISO 527-1,-2
Tensile Strength, Yield 62.0 MPa8990 psi50 mm/min; ISO 527-1,-2
Elongation at Break >= 50 %>= 50 %50 mm/min; b.o. ISO 527-1,-2
Elongation at Yield 4.9 %4.9 %50 mm/min; ISO 527-1,-2
Tensile Modulus 2.50 GPa363 ksi1 mm/min; ISO 527-1,-2
Izod Impact, Notched (ISO)  15.0 kJ/m²
@Temperature -30.0 °C		7.14 ft-lb/in²
@Temperature -22.0 °F		ISO 180-A
 48.0 kJ/m²
@Temperature 23.0 °C		22.8 ft-lb/in²
@Temperature 73.4 °F		ISO 180-A
Izod Impact, Unnotched (ISO) NB
@Temperature 23.0 °C		NB
@Temperature 73.4 °F		ISO 180-U
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+17 ohm-cm1.00e+17 ohm-cmIEC 60093
Surface Resistance 1.00e+17 ohm1.00e+17 ohmIEC 60093
Dielectric Constant  2.9
@Frequency 100 Hz		2.9
@Frequency 100 Hz		IEC 60250
 2.9
@Frequency 1e+6 Hz		2.9
@Frequency 1e+6 Hz		IEC 60250
Dielectric Strength 35.0 kV/mm
@Thickness 1.00 mm		889 kV/in
@Thickness 0.0394 in		IEC 60243-1
Dissipation Factor  0.0030
@Frequency 100 Hz		0.0030
@Frequency 100 Hz		IEC 60250
 0.0090
@Frequency 1e+6 Hz		0.0090
@Frequency 1e+6 Hz		IEC 60250
Comparative Tracking Index 250 V250 VSolution A; IEC 60112
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow 70.0 µm/m-°C
@Temperature 23.0 - 55.0 °C		38.9 µin/in-°F
@Temperature 73.4 - 131 °F		ISO 11359-1,-2
CTE, linear, Transverse to Flow 70.0 µm/m-°C
@Temperature 23.0 - 55.0 °C		38.9 µin/in-°F
@Temperature 73.4 - 131 °F		ISO 11359-1,-2
Deflection Temperature at 0.46 MPa (66 psi) 127 °C261 °FISO 75-1,-2
Deflection Temperature at 1.8 MPa (264 psi) 109 °C228 °FISO 75-1,-2
Vicat Softening Point  129 °C
@Load 5.10 kg		264 °F
@Load 11.2 lb		50°C/h; ISO 306
 131 °C
@Load 5.10 kg		268 °F
@Load 11.2 lb		120°C/h; ISO 306
Flammability, UL94 HB
@Thickness 0.850 mm		HB
@Thickness 0.0335 in
 
Processing PropertiesMetricEnglishComments
Melt Temperature 260 °C500 °FInjection molding; ISO 294
Mold Temperature 80.0 °C176 °FInjection molding; ISO 294
Injection Velocity 240 mm/sec9.45 in/secISO 294

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PB09683 / 150815

USP Class VI adhesives




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