Aptek THERM-PAD 1100 Thermally conductive silicone pad

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

(Viewing data as-entered. Click here to return)

Aptek THERM-PAD 1100 Thermally conductive silicone pad
Categories:	Polymer; Thermoset; Rubber or Thermoset Elastomer (TSE); Silicone; Silicone Elastomer, for Thermal Management
Material Notes:	Ultra soft, thermally conductive silicone pad THERM-PAD-1100 is a mineral filled, highly conformable, void-free, electrically insulating silicone pad designed to fill air gaps and dissipate heat between devices and substrates such as heat sinks. THERM-PAD 1000 is a 100% solid, fully crosslinked (C-staged Uniform filler distribution for consistent thermal dissipation capability throughput pad segment; Easily compressible up to 50% of its thickness to conform to various component heights; Very low modulus for minimum stress buildup around components; Low Tg (-60ºC) for excellent low temperature cycle performance (-110ºC Tg version available for space applications); Exceeds NASA outgassing requirements for high vacuum environments; Typical pad thickness, 0.03 to 0.125 in. Information provided by Aptek Laboratories, Inc.
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Original Value	Comments

Density	1.40 g/cc	ASTM D1475
Outgassing - Total Mass Loss	0.11 %	Cured property; at 10E-6 torr; ASTM E595
Collected Volatile Condensable Material	0.02 %	Cured property; at 10E-6 torr; ASTM E595

Mechanical Properties	Original Value	Comments
Hardness, Shore A	<= 3	Cured property; ASTM D2240
Tensile Strength, Ultimate	75.0 psi @Thickness 1.57 mm	Cured; ASTM D638
Elongation at Break	350 % @Thickness 1.57 mm	Cured; ASTM D638

Electrical Properties	Original Value	Comments
Volume Resistivity	1.60e+14 ohm-cm	Cured property; ASTM D257
Dielectric Constant	4.2 @Frequency 1000 Hz	Cured property; ASTM D150
Dielectric Strength	550 V/mil @Thickness 0.127 mm	Cured; ASTM D149
Dissipation Factor	0.0030 @Frequency 1000 Hz	Cured property; ASTM D150

Thermal Properties	Original Value	Comments
Thermal Conductivity	1.00 - 2.00 W/m-K	APTEK Test

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

Users viewing this material also viewed the following:
Copper, Cu; Cold-Worked
Copper, Cu; Annealed
MarkeTech AN 180 Aluminum Nitride Ceramic Substrate, 99% Purity
Aluminum Nitride, AlN
Gallium Nitride, GaN

PAPTEK20 / 24182

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message