Test specimens were transfer molded and post cured 4 hours at 175°C. A state-of-the-art, ultra low stress epoxy encapsulant designed for packaging large, stress-sensitive DIPs, PLCCs and QFPs. It is formulated with a unique filler system that reduces the expansion coefficient without compromising moldability. Ultra low stress properties; Outstanding moldability (good mold filling, low wire sweep, fast cycles and good hot hardness); Superior reliability |