Cookson Group STAYCHIP® 3080 High Reliability Flip Chip Underfill, Fast Flow and Cure

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Cookson Group STAYCHIP® 3080 High Reliability Flip Chip Underfill, Fast Flow and Cure (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy
Material Notes:	STAYCHIP 3080 is a high reliability capillary underfill designed for high performance adhesion to common mask, solder, and die passivation surfaces, even after exposure to elevated heat, pressure, and humidity. This material provides superior adhesion even after pressure cooker environmental conditioning. This fast flow underfill was formulated for penetration of gaps below 1mil. When fully cured, the material displays excellent reliability in thermal cycling performance. It is easily dispensed and also exhibits low moisture absorption for improved JEDEC performance. Features: Excellent reliability in thermal cycling Excellent Reliability in JEDEC testing (L3 260°C on select laminate based FCIP) Low Moisture Absorption Exceptional Adhesion (even after exposure to high humidity, pressure, and temperature) Fast, Efficient Flow Properties Information provided by Cookson Electronics
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Physical Properties	Original Value	Comments

Specific Gravity	1.50 g/cc	ASTM D 1475-60
Filler Content	42 %
Moisture Absorption at Equilibrium	<= 0.50 %	2 hour boil
Particle Size	<= 10 µm
Brookfield Viscosity	4100 cP	Brookfield #51 at 10 RPM
Storage Temperature	<= -40.0 °C

Mechanical Properties	Original Value	Comments
Hardness, Shore D	85	ASTM D 2240
Flexural Modulus	3.60 GPa	ASTM D 790
Fracture Toughness	1.90 MPa-m½
Adhesive Bond Strength	55.0 MPa	Shear strength to Si3N4 passivated Silicon Die, 75 micron gap, 5x5 mm

Electrical Properties	Original Value	Comments
Dielectric Constant	3.4 @Frequency 1000 - 100000 Hz
Dissipation Factor	0.0020 @Frequency 1000 Hz
	0.0030 @Frequency 10000 Hz
	0.0080 @Frequency 100000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	48.0 µm/m-°C @Temperature 20.0 °C	Alpha 1
	138 µm/m-°C @Temperature 20.0 °C	Alpha 2
Glass Transition Temp, Tg	132 °C	By DSC
Flash Point	>= 201 °C	ASTM D 93-85

Processing Properties	Original Value	Comments
Pot Life	1440 min @Temperature 25.0 °C	Time to double viscosity
Shelf Life	6.00 Month @Temperature -40.0 °C

Descriptive Properties
Appearance	Black
Capillary Flow Time	30 seconds	Flow time @ 100°C, Glass-to-FR4, 0.001in/25micron gap, 0.75" flow
Chemical Type	Epoxy
Extractable Ionic Content, Chloride (Cl)	<10 ppm
Extractable Ionic Content, Potassium (K)	<1 ppm
Extractable Ionic Content, Sodium (Na)	<1 ppm

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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