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Chemically Resistant adhesives

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Cookson Group Plaskon® 3300SH Mineral Filled Epoxy Molding Compound  (discontinued **)
Categories: Polymer; Thermoset; Epoxy; Epoxy, Molded, Mineral Filled; Filled/Reinforced Thermoset

Material Notes: Test specimens were transfer molded and post cured 4 hours at 175°C.

Exhibits exceptional reliability, excellent moldability, good release characteristics and low flash. This compound is especially formulated for improved hermeticity protection with high temperature compatibility and low stress.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 1.86 g/cc
Spiral Flow 78.0 - 102 cm177°C/1000 psi
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 75
Tensile Strength, Ultimate 83.0 MPa
Flexural Strength 124 MPa
Flexural Modulus 16.0 GPa
 
Electrical PropertiesOriginal ValueComments
Dielectric Constant 3.8
@Frequency 1000 Hz
Dielectric Strength 16.0 kV/mm
Dissipation Factor 0.0020
@Frequency 1000 Hz
Arc Resistance 18 sec
 
Thermal PropertiesOriginal ValueComments
CTE, linear 21.0 µm/m-°C
@Temperature 20.0 °C
CTE, linear, Transverse to Flow 69.0 µm/m-°C
@Temperature 20.0 °C
Thermal Conductivity 0.700 W/m-K
Glass Transition Temp, Tg 155 °C
Flammability, UL94 V-0
@Thickness 3.20 mm
 V-0
@Thickness 3.20 mm
 
Processing PropertiesOriginal ValueComments
Processing Temperature 170 - 190 °CMolding temperature

**
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PCOOK311 / 21407

Chemically Resistant adhesives

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