Resin Technology Group KONA 870FT-LVDP Low Viscosity Epoxy Casting System with High Thermal Conductivity

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Resin Technology Group KONA 870FT-LVDP Low Viscosity Epoxy Casting System with High Thermal Conductivity
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	Mix ratio 2 to 1 by volume. KONA 870 FTLV-DP is a low viscosity, versatile epoxy casting system that exhibits unusually high thermal conductivity and low thermal expansion. This product is specifically designed for use in a two to one mix ratio side-by-side dispensing system. It is recommended for small electronic/electrical casting and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal expansion coefficients, thermal shock resistance, high heat transfer capabilities and outstanding electrical properties. Fully cured KONA 870 FTLV-DP is highly resistant to weather, water, gases and vapors, petroleum lubricants and fuels and many mild acids and alkalis. Information provided by Resin Technology Group.
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Physical Properties	Original Value	Comments

Specific Gravity	2.00 g/cc

Mechanical Properties	Original Value	Comments
Hardness, Shore D	91
Tensile Strength at Break	7150 psi
Compressive Strength	23100 psi

Electrical Properties	Original Value	Comments
Dielectric Strength	520 V/mil
Dissipation Factor	0.0024 @Frequency 1e+6 Hz

Thermal Properties	Original Value	Comments
Thermal Conductivity	10.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	100 °C
Minimum Service Temperature, Air	-40.0 °C

Processing Properties	Original Value	Comments
Cure Time	6.00 - 8.00 hour @Temperature 25.0 °C
Gel Time	15.0 min	At 25°C, 25 g mass

Descriptive Properties
Color	Black

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