Henkel Loctite® ABLESTIK 8387B Epoxy

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Henkel Loctite® ABLESTIK 8387B Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Black Product Benefits: Non-conductive Fast cure Black pigmentation for blocking stray light Cure: Heat cure Application: Die attach Typical Package Application: Optoelectronic devices LOCTITE ABLESTIK 8387B non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. In conventional box or convection conveyor oven curing, it will cure at temperatures as low as 100ºC. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Brookfield Viscosity	9500 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	53.0 MPa @Temperature 250 °C	Cured, DMTA
	59.0 MPa @Temperature 200 °C	Cured, DMTA
	77.0 MPa @Temperature 150 °C	Cured, DMTA
	580 MPa @Temperature 100 °C	Cured, DMTA
	1400 MPa @Temperature 25.0 °C	Cured, DMTA
	2840 MPa @Temperature -65.0 °C	Cured, DMTA
Shear Strength	1.90 MPa	Die, 12.7 x 12.7 mm Si die on Cu LF @ 250°C
	27.0 MPa	Die, 2 x 2 mm Si die on T2 FR4 LF
	28.1 MPa	Die, 3 x 3 mm Si die on Ag/Cu LF
	30.5 MPa	Die, 3 x 3 mm Si die on Cu LF

Thermal Properties	Original Value	Comments
CTE, linear	94.0 µm/m-°C	Cured, Below Tg
	165 µm/m-°C	Cured, Above Tg
Glass Transition Temp, Tg	96.0 °C	Cured, TMA

Processing Properties	Original Value	Comments
Cure Time	2.00 min @Temperature 150 °C
	30.0 min @Temperature 100 °C	Alternate Cure Schedule
Working Life	48.0 hour
Shelf Life	12.0 Month	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<10	Cured, Sodium (Na+)
	<300	Cured, Chloride (Cl-)
	<5	Cured, Potassium (K+)
Thixotropic Index	>4.5	Uncured, 0.5/5 rpm
Water Extract Conductivity	190 µmhos/cm	Cured

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PLOCT5031 / 255242

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