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Ensinger PEI

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Henkel Loctite® ECCOBOND FP4651 Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Black

Cure: Heat Cure

Product Benefits:

  • High purity
  • Self-leveling
  • Excellent chemical resistance
  • High thermal stability
  • Low thermal expansion
  • Low viscosity
Components: One-component

Application: Encapsulant

Typical Application: Cavity-fill and fine wire pitch applications

LOCTITE ECCOBOND FP4651 epoxy encapsulant features very low thermal expansion while retaining syringe dispense capabilities. Its low viscosity and 50 micron maximum particle size gives it improved handling properties over FP4650 for fine wire pitch and cavity-fill applications. It is based on FP4450 resin chemistry, therefore exhibiting excellent chemical resistance and thermal stability properties.

Information provided by Loctite®

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Physical PropertiesOriginal ValueComments
Filler Content 82 %
Brookfield Viscosity 130000 cPSpindle 7, speed 20 rpm
 
Thermal PropertiesOriginal ValueComments
CTE, linear 11.0 µm/m-°C
@Temperature 40.0 - 120 °C
Cured, Below Tg
 50.0 µm/m-°C
@Temperature 190 - 220 °C
Cured, Above Tg
Glass Transition Temp, Tg 150 °CCured
 
Processing PropertiesOriginal ValueComments
Cure Time 1.00 hour
@Temperature 125 °C
plus 90 minutes @ 165°C
 2.00 hour
@Temperature 110 °C
plus 3 hours @ 165°C
Gel Time 9.00 min
@Temperature 121 °C
 
Descriptive Properties
Extractable Ionic Content (ppm)1Cured, Sodium (Na+)
 1Cured, Potassium (K+)
 5Cured, Chloride (Cl-)
Pot Life2 daysTime required to double viscosity

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PLOCT5084 / 255295

Proto3000 – 3D Engineering Solutions

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