Appearance: Black Cure: Heat Cure Product Benefits: - High purity
- Self-leveling
- Excellent chemical resistance
- High thermal stability
- Low thermal expansion
- Low viscosity
Components: One-componentApplication: Encapsulant Typical Application: Cavity-fill and fine wire pitch applications LOCTITE ECCOBOND FP4651 epoxy encapsulant features very low thermal expansion while retaining syringe dispense capabilities. Its low viscosity and 50 micron maximum particle size gives it improved handling properties over FP4650 for fine wire pitch and cavity-fill applications. It is based on FP4450 resin chemistry, therefore exhibiting excellent chemical resistance and thermal stability properties. Information provided by Loctite® |