Henkel Loctite® ABLESTIK ABP 2032S Epoxy

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Henkel Loctite® ABLESTIK ABP 2032S Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Silver Product Benefits: Electrically conductive Low temperature cure Good adhesion Good dispensing characteristics Cure: Heat cure Application: Die attach Key Substrates: Au, Steel and Ag LOCTITE ABLESTIK ABP 2032S electrically conductive adhesive is designed as a Pb-free alternative to solder. It cures quickly at low temperatures for good stress control in large die size package applications. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Brookfield Viscosity	11000 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	150 MPa @Temperature 250 °C	Cured, DMA
	1200 MPa @Temperature 100 °C	Cured, DMA
	4600 MPa @Temperature 25.0 °C	Cured, DMA

Thermal Properties	Original Value	Comments
CTE, linear	54.0 µm/m-°C	Cured, Below Tg
	162 µm/m-°C	Cured, Above Tg
Thermal Conductivity	1.00 W/m-K
Glass Transition Temp, Tg	110 °C	Cured, TMA

Processing Properties	Original Value	Comments
Cure Time	1.00 min @Temperature 80.0 °C
	3.00 min @Temperature 150 °C	Alternative Cure Schedule
	10.0 min @Temperature 120 °C	Alternative Cure Schedule
Working Life	24.0 hour
Shelf Life	12.0 Month @Temperature -40.0 °C	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<20	Cured, Sodium (Na+)
	<20	Cured, Potassium (K+)
	<30	Cured, Chloride (Cl-)
Shear Strength	15.5 kg-f	Die, 2 X 2 mm Si die, Sample cured 60 minutes @ 80°C On Steel
	16 kg-f	Die, 2 X 2 mm Si die, Sample cured 60 minutes @ 80°C On Ag
	16 kg-f	Die, 2 X 2 mm Si die, Sample cured 60 minutes @ 80°C On Au
Thixotropic Index	4.5	Uncured, 0.5/5 rpm
Weight Loss (%)	0.7	on Cure

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PLOCT5037 / 255248

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