Resin Technology Group TIGA 920H Flexible Silver Conductive

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Resin Technology Group TIGA 920H Flexible Silver Conductive
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	100 parts resin to 115 parts hardener. TIGA 920-H is a flexible, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications that require high flexibility, conductivity, and mechanical performance. This smooth paste formulation of pure silver and epoxy is free of solvents and extraneous additives. It develops strong, durable, electrically and thermally conductive bonds between many dissimilar materials including metals, ceramics and plastic laminates. TIGA 920-H cures at room temperature and can be used as a flexible “cold solder” for heat sensitive parts. It can also be used in the assembly and repair of flexible circuits, electrical components and electronic shielding. Information provided by Resin Technology Group.
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Physical Properties	Original Value	Comments

Specific Gravity	2.90 g/cc
Solids Content	100 %	Reactive

Mechanical Properties	Original Value	Comments
Hardness, Shore D	55
Shear Strength	>= 500 psi	Lap, Au/Au
	>= 500 psi	Lap, Kaptona
	>= 1000 psi	Lap, Al/Al

Electrical Properties	Original Value	Comments
Volume Resistivity	<= 0.0010 ohm-cm	Cured 2 hours at 65°C
	<= 0.0010 ohm-cm	Cured 1 hour at 110°C
	0.050 ohm-cm	Cured 12-24 hours at 25°C

Thermal Properties	Original Value	Comments
Thermal Conductivity	0.00370 cal cm/sec-cm²-°C
Maximum Service Temperature, Air	110 °C
Minimum Service Temperature, Air	-60.0 °C

Processing Properties	Original Value	Comments
Pot Life	180 min @Temperature 25.0 °C

Descriptive Properties
Color	Silver
Viscosity	Smooth paste

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PRESINT604 / 65488

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