Henkel Loctite® ECCOBOND FP4451 Epoxy

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Henkel Loctite® ECCOBOND FP4451 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Black Cure: Heat cure Product Benefits: High purity Minimal slumping Green product Application: Encapsulant - dam Typical Package Application: BGA and IC memory cards LOCTITE ECCOBOND FP4451 damming material is designed as a flow control barrier around areas of bare chip encapsulation. LOCTITE ECCOBOND FP4451 used in combination with FP4450, LOCTITE ECCOBOND FP4451 and other Henkel encapsulants passes pressure pot performance on live devices up to 500 hours with no failures depending on device and package type. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Specific Gravity	1.76 g/cc
Filler Content	72 %
Brookfield Viscosity	860000 cP	Spindle 7, speed 4 rpm
	1.30e+6 cP	Spindle 7, speed 2 rpm

Thermal Properties	Original Value	Comments
CTE, linear	22.0 µm/m-°C @Temperature 40.0 - 120 °C	Cured, Below Tg
Maximum Service Temperature, Air	150 °C
Minimum Service Temperature, Air	-65.0 °C
Glass Transition Temp, Tg	155 °C	Cured, by TMA

Processing Properties	Original Value	Comments
Cure Time	1.00 hour @Temperature 165 °C	Alternate Cure Schedule
	30.0 min @Temperature 120 °C	plus 90 minutes @ 165°C
Gel Time	8.00 min @Temperature 121 °C
Shelf Life	9.00 Month @Temperature -40.0 °C	from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	1	Cured, Potassium (K+)
	10	Cured, Chloride (Cl-)
	4	Cured, Sodium (Na+)
Pot Life	2 days	time to double viscosity

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PLOCT5090 / 255301

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