| This product is a silver paste composition designed for screen print application of a solderable electrode base onto various types of electrical ceramic component devices. The fired film forms a highly adherent bond to many types of substrates such as piezo-electric transducers (PZTs), NTC thermistors, alumina, steatite, and porcelain without altering the electrical and mechanical properties of the dielectric body. It is intended for lower firing applications where a higher temperature cannot be tolerated. The bonded electrode is readily solderable for external lead attachment.All information provided by Lord. |
