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Chemically Resistant adhesives

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Parker Chomerics THERM-A-GAP™ T652 Thermally Conductive, Fully Cured, Dispensable Gap Filler
Categories: Polymer; Thermoset; Silicone

Material Notes: Description: THERM-A-GAP™ T652 material is a highly conformable, pre-cured, single-compound. This unique material results in much lower mechanical stress on delicate components than even the softest gap-filling sheets. It is ideal for filling variable gaps between multiple components and a common heat sink.

Product Features: Dispensable; Fully cured; High and low volume package sizes for use with manual or automated meter-mix; No settling in storage; Highly conformable at low pressure; Ideal for gap sizes 0.2mm to 4mm and Available with 0.010” glass bead

Typical Applications: Engine control unites (ECU’s); Transmission and control devices; electrical drives; Steering and braking systems; Memory modules; LEDs; Power conversion equipment; Power supplies and UPS and Power semiconductors.

Information provided by Chomerics

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Physical PropertiesOriginal ValueComments
Specific Gravity 2.80 g/ccASTM D792
Deformation 26 %
@Pressure 0.00689 MPa
ASTM C165 MOD
 72 %
@Pressure 0.0207 MPa
ASTM C165 MOD
 85 %
@Pressure 0.0345 MPa
ASTM C165 MOD
 >= 90 %
@Pressure 0.0689 MPa
ASTM C165 MOD
Outgassing - Total Mass Loss 0.20 %ASTM D6375
 
Electrical PropertiesOriginal ValueComments
Dielectric Constant 5.0
@Frequency 1e+6 Hz
ASTM D150
Dielectric Strength 100 kV/mmASTM D149
Dissipation Factor 0.010
@Frequency 1e+6 Hz
Chomerics
 
Thermal PropertiesOriginal ValueComments
CTE, linear 150 µm/m-°CASTM E831
Specific Heat Capacity 1.00 J/g-°CASTM D1269
Thermal Conductivity 3.00 W/m-K
Maximum Service Temperature, Air 150 °C
Minimum Service Temperature, Air -50.0 °C
 
Processing PropertiesOriginal ValueComments
Shelf Life 18.0 MonthFrom date of manufacture; Chomerics
 
Descriptive Properties
ColorWhite
Flow Rate10 cc/min30cc syringe with no tip attachment, 0.1" orifice, 90 psi; Chomerics

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PCHOME323 / 131033

Chemically Resistant adhesives

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