Henkel Loctite® ABLESTIK ABP 8910T Adhesive

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Henkel Loctite® ABLESTIK ABP 8910T Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Appearance: B lue Cure: Heat cure Product Benefits: High MRT performance High thermal conductivity Electrically Insulating High reliability Application: Die attach Key Substrates: Copper, Silver, PPF and Alloy 42 Filler Type: Alumina LOCTITE ABLESTIK ABP 8910T die attach adhesive is formulated with a medium modulus using hybrid chemistry and is targeted for use on medium to large die sizes. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Brookfield Viscosity	13000 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	1007 MPa @Temperature 250 °C	Cured, DMTA
	1096 MPa @Temperature 200 °C	Cured, DMTA
	2030 MPa @Temperature 150 °C	Cured, DMTA
	8870 MPa @Temperature 25.0 °C	Cured, DMTA
	10270 MPa @Temperature -65.0 °C	Cured, DMTA

Thermal Properties	Original Value	Comments
CTE, linear	28.0 µm/m-°C	Cured, Below Tg
	96.0 µm/m-°C	Cured, Above Tg
Thermal Conductivity	1.30 W/m-K	Cured
Glass Transition Temp, Tg	30.0 °C	Cured, TMA penetration mode

Processing Properties	Original Value	Comments
Cure Time	30.0 min	ramp to 175°C + 15 minutes @ 175°C
Working Life	24.0 hour
Shelf Life	12.0 Month @Temperature -40.0 °C	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<20	Cured, Chloride (Cl-)
	<20	Cured, Sodium (Na+)
	<20	Cured, Potassium (K+)
Shear Strength	1.1 kg-f/die	Die, 7.5 X 7.5 mm (300 x 300 mil) Si die, PMB + Moisture on Silver
	1.4 kg-f/die	Die, 7.5 X 7.5 mm (300 x 300 mil) Si die, PMB + Moisture on PPF
	1.9 kg-f/die	Die, 7.5 X 7.5 mm (300 x 300 mil) Si die, PMB + Moisture on Alloy 42
	1.9 kg-f/die	Die, 7.5 X 7.5 mm (300 x 300 mil) Si die, PMB + 5 minutes @ 270°C on PPF
	15.4 kg-f/die	Die, 3 X 3 mm (120 x 120 mil) @ 270 °C, Si die on Ag leadframe, @ 25ºC
	15.6 kg-f/die	Die, 7.5 X 7.5 mm (300 x 300 mil) Si die, PMB + 5 minutes @ 270°C on Copper
	16.7 kg-f/die	Die, 7.5 X 7.5 mm (300 x 300 mil) Si die, Post Mold Bake (PMB) on Copper
	2.0 kg-f/die	Die, 7.5 X 7.5 mm (300 x 300 mil) Si die, PMB + 5 minutes @ 270°C on Silver
	2.1kg-f/die	Die, 7.5 X 7.5 mm (300 x 300 mil) Si die, Post Mold Bake (PMB) on PPF
	4.3 kg-f/die	Die, 7.5 X 7.5 mm (300 x 300 mil) Si die, Post Mold Bake (PMB) on Silver
	4.4 kg-f/die	Die, 3 X 3 mm (120 x 120 mil) @ 270 °C, Si die on Ag leadframe, @ 250ºC
	4.6 kg-f/die	Die, 7.5 X 7.5 mm (300 x 300 mil) Si die, PMB + Moisture on Copper
	5.5 kg-f/die	Die, 3 X 3 mm (120 x 120 mil) @ 270 °C, Si die on Ag leadframe, @ 200ºC
	8.1 kg-f/die	Die, 7.5 X 7.5 mm (300 x 300 mil) Si die, PMB + 5 minutes @ 270°C on Alloy 42
	8.5 kg-f/die	Die, 7.5 X 7.5 mm (300 x 300 mil) Si die, Post Mold Bake (PMB) on Alloy 42
Thixotropic Index	>4.5	Uncured, 0.5/5 rpm

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