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Master Bond adhesives

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Momentive Performance Materials TSE3281G Thermally Conductive, Heat Cured Silicone Adhesive  (discontinued **)
Categories: Polymer; Adhesive; Thermoset; Rubber or Thermoset Elastomer (TSE); Silicone; Silicone Elastomer, for Thermal Management

Material Notes: TSE3280G and TSE3281G silicone adhesives are one component, medium viscosity, thermally conductive materials which remain in an uncured state at room temperature and cure to an elastomer when heat is applied.

TSE3280G and TSE3281G silicone adhesives provide much higher thermal conductivity than conventional silicone adhesives which make them ideal for electrical and electronic applications where high thermal transfer is required. They are non-corrosive and have excellent adhesion properties to a wide variety of substrates without the need for using a primer.

Mechanical, electrical, and thermal properties for specimen cured 1 hour at 150°C.

Key Performance Properties:

  • Excellent thermal conductivity properties
  • Fast thermal cure times
  • Excellent adhesion to many substrates without the use of a primer
  • Outstanding operating temperature performance (-55C to 200C, -67F to 392F)
  • One component, solventless formulation for ease of handling
  • No cure by-products / low shrinkage / non-exothermic allows for deep section application and use in enclosed assemblies
  • Reversion resistant and hydrolytically stable
  • Outstanding dielectric properties

GE Silicones became a part of Momentive Performance Materials in 2006.

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Physical PropertiesOriginal ValueComments
Specific Gravity 2.70 g/cc
Viscosity 40000 cP
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 84
Tensile Strength, Ultimate 46.0 kg(f)/cm²
Elongation at Break 50 %
Adhesive Bond Strength 355 psiLap shear
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 4.80e+14 ohm-cm
Dielectric Constant 5.4
@Frequency 60 Hz
Dielectric Strength 15.0 kV/mm
Dissipation Factor 0.0020
@Frequency 60 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 140 µm/m-°C
@Temperature 20.0 °C
Thermal Conductivity 1.68 W/m-K
Maximum Service Temperature, Air 200 °C
Minimum Service Temperature, Air -55.0 °C
 
Descriptive Properties
ColorGray

**
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