| TRA-BOND FS309 is a thixotropic (smooth paste) heat conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. This two-part adhesive develops strong, durable, high-impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. TRA-BOND FS309 bonds readily to itself, and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coeffcient of thermal expansion provides a good match for those materials over a fairly wide temperature range. Fully cured TRA-BOND FS309 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol. Information provided by Tra-Con Inc. |
