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Master Bond adhesives

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Epoxy Technology EPO-TEK® 323LP Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Material Description: Longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, hard-disk drive and medical applications.

Information Provided by Epoxy Technology

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.09 g/ccPart B
 1.20 g/ccPart A
Viscosity 3500 - 5000 cP
@Temperature 23.0 °C
50 rpm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 88
Tensile Modulus 388000 psiStorage
Shear Strength >= 2000 psiLap
 >= 6800 psiDie
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 3.00e+12 ohm-cm
Dielectric Constant 2.62
@Frequency 1000 Hz
Dissipation Factor 0.032
@Frequency 1000 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 31.0 µm/m-°CBelow Tg
 132 µm/m-°CAbove Tg
Maximum Service Temperature, Air 250 °CContinuous
 350 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 100 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 413 °CDegradation Temperature
 
Optical PropertiesOriginal ValueComments
Refractive Index 1.5703
@Wavelength 589 nm
Transmission, Visible <= 94 %
@Wavelength 820 - 1620 nm
Spectral
 
Processing PropertiesOriginal ValueComments
Cure Time 30.0 min
@Temperature 90.0 °C
Pot Life 1440 min
Shelf Life 12.0 Month
@Temperature 25.0 °C
 
Descriptive Properties
ColorClear to Slight YellowPart A
 YellowPart B
ConsistencyPourable liquid
Mix Ratio by Weight10:1
Number of ComponentsTwo
Weight Loss0.31%200°C
 0.46%250°C
 0.85%300°C

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PPOXYT120 / 141159

Rulon Bearings

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