Cookson Group Plaskon® PPF-165A Molding Compound

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Cookson Group Plaskon® PPF-165A Molding Compound (discontinued **)
Categories:	Polymer; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	Test specimens were transfer molded and post cured 4 hours at 175°C. A conventional molding compound specifically formulated for semiconductor devices which are molded with preplated leadframes. Low temperature molding; Limited, if any, post mold cure; Fast cure rate; Low viscosity for consistent, reproducible moldability; Outstanding reliability; Excellent shelf life; PPF-165A is a low lube version for reduced cleaning frequency
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Physical Properties	Original Value	Comments

Density	1.80 g/cc
Viscosity	11000 cP @Temperature 175 °C	Automatic orifice Viscosity
Linear Mold Shrinkage	0.0030 cm/cm
Spiral Flow	72.0 cm	165°C/1000 psi

Mechanical Properties	Original Value	Comments
Hardness, Shore D	80
Flexural Strength	124 MPa
Flexural Modulus	15.0 GPa

Electrical Properties	Original Value	Comments
Dielectric Constant	3.5 @Frequency 1000 Hz
Dielectric Strength	16.0 kV/mm
Dissipation Factor	0.0030 @Frequency 1000 Hz
Arc Resistance	180 sec

Thermal Properties	Original Value	Comments
CTE, linear	21.0 µm/m-°C @Temperature 20.0 °C
CTE, linear, Transverse to Flow	67.0 µm/m-°C @Temperature 20.0 °C
Thermal Conductivity	0.600 W/m-K
Glass Transition Temp, Tg	157 °C
Flammability, UL94	V-0 @Thickness 3.20 mm
	V-0 @Thickness 3.20 mm

Processing Properties	Original Value	Comments
Processing Temperature	165 - 175 °C	Molding temperature

**
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PCOOK321 / 21417

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