Cookson Group Plaskon® SMT-B-1N Molding Compound for PBGAs

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

(Viewing data as-entered. Click here to return)

Cookson Group Plaskon® SMT-B-1N Molding Compound for PBGAs (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy molding compound optimized specifically for PBGA applications with no plasma cleaning required before molding. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for PBGA and CSP applications. Features: Faster cure speed Improved wire sweep performance Lower viscosity No plasma cleaning required before molding Information provided by Cookson Electronics
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Original Value	Comments

Specific Gravity	1.88 g/cc
Moisture Absorption at Equilibrium	0.60 %	at 85°C/85% RH, 168 hours
Viscosity	4400 cP @Temperature 175 °C	Automatic orifice, at 1000 psi
Spiral Flow	112 cm	at 175°C and 1000 psi
Ash	78 %
Storage Temperature	<= 5.00 °C	Recommended

Mechanical Properties	Original Value	Comments
Hardness, Shore D	85	Cull hot
Flexural Strength	14790 psi
	7111.7 psi @Temperature 215 °C
Flexural Modulus	2.148e+6 psi
	1.166e+6 psi @Temperature 215 °C

Electrical Properties	Original Value	Comments
Volume Resistivity	5.60e+16 ohm-cm @Temperature 22.0 °C
Dielectric Constant	3.7 @Frequency 1000 Hz
Dielectric Strength	568 V/mil
Dissipation Factor	0.0030 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	16.0 µm/m-°C @Temperature 20.0 °C	Alpha 1
	56.0 µm/m-°C @Temperature 20.0 °C	Alpha 2
Thermal Conductivity	0.860 W/m-K
Glass Transition Temp, Tg	224 °C
Flammability, UL94	V-0 @Thickness 3.17 mm
Oxygen Index	32 %

Processing Properties	Original Value	Comments
Mold Temperature	175 °C
Back Pressure	800 - 1200 psi
Cure Time	60.0 - 150 sec	In mold
	0.000 - 4.00 hour @Temperature 175 °C	Post mold
Gel Time	0.183 min	Ram follower, at 175°C and 1000 psi
Shelf Life	0.100 Month	at 35°C, <40% loss of spiral flow
	0.250 Month	at 21°C, <40% loss of spiral flow
	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Halides	<1 ppm

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

Users of our Advanced Search (registration required) may exclude discontinued materials from search results.

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

PPLASK004 / 56294

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message