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Ensinger PEI

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A. Schulman BMC 945 Conductive Grade Bulk Molding Compound
Categories: Polymer; Thermoset; Polyester, TS; Thermoset Polyester Glass and Mineral Filled BMC

Material Notes: BMC 945 is an ESD level Conductive grade of Bulk Molding Compound and is suitable for compression, transfer and stuffer injection molding. It is characterized by excellent flow and controlled reactivity and is well suited for injection molding.

Typical applications may include electronic enclosures, computer chip trays and storage boxes, and other applications requiring ESD level conductivity.

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.75 - 1.95 g/cc
Water Absorption 0.14 - 0.21 %24 hours, 23°C
Linear Mold Shrinkage 0.0050 - 0.010 cm/cm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Barcol 45 - 55
Tensile Strength, Ultimate 6000 - 7500 psi
Flexural Strength 12000 - 14000 psi
Flexural Modulus 1800 - 2000 ksi
Compressive Strength 18000 - 20000 psi
Izod Impact, Notched 2.00 - 3.00 ft-lb/in
 
Electrical PropertiesOriginal ValueComments
Surface Resistivity per Square 1e+05 - 1.00e+7 ohm
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 1.8 MPa (264 psi) >= 450 °F
Glass Transition Temp, Tg >= 165 °C
Flammability, UL94 V-0
@Thickness 3.17 mm
 
Processing PropertiesOriginal ValueComments
Mold Temperature 280 - 330 °F

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