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Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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Superior Flux Superior No. 45 NSG Organic Acid, Halide Flux
Categories: Metal; Nonferrous Metal; Solder/Braze Alloy

Material Notes:
  • Formulated for tinning Nickel/Copper semiconductor and component leads in automated soldering systems.
  • Promotes excellent solderability of electroless Nickel (EN), Alloy 42, Alloy 51, Beryllium Copper, and other difficult-to-solder metals.
  • Helps achieve high first-pass yields to meet ISO standards.
  • Excellent flux for tin/lead and lead-free alloys.
  • Solder coatings pass steam-aging tests.
  • Flux conforms to IPC-ANSI-J-STD-004, Type ORM1.
Description: Superior No. 45 NSG is an organic-acid (OA) flux that contains a unique amino acid-chloride activator. The flux removes oxides at room temperature, reaching peak activity in a temperature range of 240-270°C/460-520°F. The flux contains little water and does not pop or spatter during normal soldering processes that include pre-heating prior to solder dipping.

Information provided by Superior Flux

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Physical PropertiesOriginal ValueComments
Specific Gravity 0.840 - 0.855 g/cc
Density 7.01 - 7.18 lb/gal
 
Chemical PropertiesOriginal ValueComments
Total Acid Number 25 - 55
 
Thermal PropertiesOriginal ValueComments
Flash Point 12.0 °CTCC Method
 
Processing PropertiesOriginal ValueComments
Processing Temperature 200 - 315 °CSoldering Range
Shelf Life 2.00 Month
 
Descriptive Properties
FormClear, red liquid
ResiduesCompletely Water Soluble

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NSFLUX020 / 185704

solder replacement adhesives

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