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Master Bond adhesives

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Sumitomo Bakelite North America 4064 Mineral Filled Electrical Encapsulation Grade Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Encapsulating, Glass or Mineral Filled; Filled/Reinforced Thermoset

Material Notes: Rogers electrical encapsulation grade epoxy is recommended for capacitors, resistors, gold lead encapsulation, relays, coils and bobbins.

Information provided by Sumitomo Bakelite North America, Inc.

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Physical PropertiesOriginal ValueComments
Density 1.79 g/ccASTM D792
Water Absorption 0.10 %48 hours, 50°C. ASTM D570
Linear Mold Shrinkage 0.0040 - 0.0070 cm/cmCompression Molding. ASTM D955
 
Mechanical PropertiesOriginal ValueComments
Hardness, Barcol 70
Tensile Strength, Ultimate 41.0 MPaASTM D638
Flexural Yield Strength 131 MPaASTM D790
Flexural Modulus 19.0 GPaASTM D790
Compressive Yield Strength 262 MPaASTM D695
Izod Impact, Notched 0.270 J/cmASTM D256A
 
Electrical PropertiesOriginal ValueComments
Dielectric Constant 3.5Wet; ASTM D150
Dielectric Strength 13.0 kV/mmWet, short term. ASTM D149
Dissipation Factor 0.019
@Frequency 1e+6 Hz
Wet; ASTM D150
Arc Resistance 180 secASTM D495
 
Thermal PropertiesOriginal ValueComments
CTE, linear, Parallel to Flow 20.0 µm/m-°C
@Temperature 20.0 °C
ASTM D696
 
Processing PropertiesOriginal ValueComments
Mold Temperature 143 - 177 °Ccompression/transfer molding.
 174 - 182 °Cinjection molding.

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

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