Cookson Group Plaskon® ALP-2 (197.sh03) Thin Package Encapsulant

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Cookson Group Plaskon® ALP-2 (197.sh03) Thin Package Encapsulant (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy encapsulant for high productivity packaging of very thin, stress-sensitive devices such as TSSOP’s. Performance attributes are intended to meet or exceed JEDEC Level 1 for all packages and have no or limited post-mold cure, fast cure cycle times tailored to specific applications and excellent adhesion to Cu and Pd-Ni leadframes. Features: Very low moisture pickup Good marketability Good moldability Fast cure Outstanding device reliability Information provided by Cookson Electronics
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Physical Properties	Original Value	Comments

Specific Gravity	1.98 g/cc
Moisture Absorption at Equilibrium	0.23 %	at 85°C/85% RH, 168 hours
Viscosity	4300 cP @Temperature 175 °C	Shimadzu Viscosity, 1000 psi
Spiral Flow	90.0 cm	at 175°C and 1000 psi
Ash	87 %
Storage Temperature	<= 5.00 °C	Recommended

Mechanical Properties	Original Value	Comments
Hardness, Shore D	79	Cull hot
Flexural Strength	17350 psi
	1564.6 psi @Temperature 260 °C
Flexural Modulus	3.223e+6 psi
	149300 psi @Temperature 260 °C

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 1.00e+9 ohm-cm @Temperature 150 °C
	>= 1.00e+12 ohm-cm @Temperature 22.0 °C
Dielectric Constant	3.8 @Frequency 1000 Hz
Dielectric Strength	>= 1400 V/mil

Thermal Properties	Original Value	Comments
CTE, linear	9.80 µm/m-°C @Temperature 20.0 °C	Alpha 1
	39.3 µm/m-°C @Temperature 20.0 °C	Alpha 2
Thermal Conductivity	1.00 W/m-K
Glass Transition Temp, Tg	146 °C
Flammability, UL94	V-0 @Thickness 3.17 mm

Processing Properties	Original Value	Comments
Mold Temperature	170 - 185 °C
Back Pressure	750 - 1250 psi
Cure Time	70.0 - 120 sec	In mold
	0.000 - 4.00 hour @Temperature 175 °C	Post mold
Gel Time	0.283 min	Ram follower, at 175°C and 1000 psi
Shelf Life	0.0167 Month	at 35°C, <40% loss of spiral flow
	0.0670 Month	at 22°C, <40% loss of spiral flow
	6.00 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Halides	<1 ppm

**
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PPLASK017 / 56307

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