Cookson Group Plaskon® 150.401 Encapsulation Resin

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Cookson Group Plaskon® 150.401 Encapsulation Resin (discontinued **)
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	Test specimens were transfer molded and post cured 4 hours at 175°C. A second generation SMT-B family product. This material is the initial developmental, general purpose SMT-B encapsulation grade resin and has good adhesion to solder resist with no plasma or UV/Ozone cleaning for PBGA applications.
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Physical Properties	Original Value	Comments

Density	1.90 g/cc
Viscosity	8200 cP @Temperature 175 °C	Shimadzu Viscosity, 1000 psi
Spiral Flow	74.0 cm	175°C/1000 psi

Mechanical Properties	Original Value	Comments
Hardness, Shore D	88
Flexural Strength	76.0 MPa
Flexural Modulus	18.0 GPa

Electrical Properties	Original Value	Comments
Electrical Resistivity	4.70e+16 ohm-cm
Dielectric Constant	3.6 @Frequency 1000 Hz
Dissipation Factor	0.0020 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	15.5 µm/m-°C @Temperature 20.0 °C
CTE, linear, Transverse to Flow	55.5 µm/m-°C @Temperature 20.0 °C
Thermal Conductivity	0.700 W/m-K
Glass Transition Temp, Tg	220 °C
Flammability, UL94	V-0 @Thickness 3.20 mm
	V-0 @Thickness 3.20 mm

Processing Properties	Original Value	Comments
Processing Temperature	170 - 185 °C	Molding temperature

**
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PCOOK335 / 21431

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