Tra-Con Tra-Bond 77-2LTC Low Temperature Cure SMD Adhesive

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Tra-Con Tra-Bond 77-2LTC Low Temperature Cure SMD Adhesive
Categories:	Polymer; Adhesive; Thermoset; Epoxy
Material Notes:	TRA-BOND 77-2LTC one component, solvent-free, insulative epoxy adhesive is designed to cure at temperatures as low as 80°C. This adhesive is specifically designed for attaching surface mounted devices (SMDs) to printed circuit boards prior to wave solder. TRA-BOND 77-2LTC adhesive exhibits superior application features. Its soft, smooth consistency permits application through fine diameter needles. It exhibits no tailing or sagging. Small, uniform dots may be dispensed for capacitor and resistor attach. To satisfy the seated heights of SOT devices, narrow peaks or multiple dots may be used. TRA-BOND 77-2LTC adhesive is also ideally suited for application by screening or pin transfer. Information provided by Tra-Con Inc.
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Physical Properties	Original Value	Comments

Viscosity	33000 cP	Mixed

Chemical Properties	Original Value	Comments
Ionic Impurities - Na (Sodium)	5.0 ppm
Ionic Impurities - K (Potassium)	5.0 ppm
Ionic Impurities - Cl (Chloride)	30 ppm

Mechanical Properties	Original Value	Comments
Hardness, Shore D	90
Adhesive Bond Strength	2300 psi	Lap shear, alum to alum

Electrical Properties	Original Value	Comments
Volume Resistivity	2.50e+14 ohm-cm
Dielectric Constant	4.2 @Frequency 1000 Hz
Dissipation Factor	0.0080 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	44.0 µm/m-°C	Below Tg
	86.0 µm/m-°C	Above Tg
Thermal Conductivity	0.500 W/m-K @Temperature 121 °C
Glass Transition Temp, Tg	80.0 °C	Ultimate Tg

Processing Properties	Original Value	Comments
Cure Time	0.500 hour @Temperature 80.0 °C
	5.00 min @Temperature 150 °C
	10.0 min @Temperature 125 °C
	15.0 min @Temperature 100 °C
Shelf Life	12.0 Month @Temperature -40.0 °C

Descriptive Properties
Device Shear grams	2000	Thick Film Resistors
Outgassing, NASA	Passes
Weight Loss %	0.24	At 300°C
Working Life days	3	At 25°C

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PTRAC153 / 71081

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