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Metal adhesives

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Tra-Con Tra-Bond 77-1S One Component SMD Adhesive
Categories: Polymer; Adhesive; Thermoset; Epoxy

Material Notes: TRA-BOND 77-1S one component, solvent-free, insulating epoxy adhesive is designed specifically for attaching surface mounted devices (SMDs) to printed circuit boards prior to wave solder. TRA-BOND 77-1S adhesive exhibits outstanding moisture resistance, eliminating concern about significant electrical leakage after long-term exposure to high humidity conditions. This adhesive withstands 1000 hours at 100°C and 95% relative humidity testing with only a slight drop in insulation resistance. In addition, TRA-BOND 77-1S adhesive exhibits superior application features. Its soft, smooth consistency permits application through fine diameter needles. This adhesive exhibits no tailing or sagging. Small uniform dots may be dispensed for capacitor and resistor attach. To satisfy the seated heights of SOT devices, narrow peaks or multiple dots may be used. TRA-BOND 77-1S adhesive is also ideally suited for application by screening or pin transfer.

Information provided by Tra-Con Inc.

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Physical PropertiesOriginal ValueComments
Viscosity 47000 cPMixed
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 94
Adhesive Bond Strength 2400 psiLap shear, alum to alum
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.30e+12 ohm-cm
Dielectric Constant 4.6
@Frequency 1000 Hz
Dissipation Factor 0.017
@Frequency 1000 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 55.0 µm/m-°CBelow Tg
 100 µm/m-°CAbove Tg
Thermal Conductivity 0.500 W/m-K
@Temperature 121 °C
Glass Transition Temp, Tg 200 °CUltimate Tg
 
Processing PropertiesOriginal ValueComments
Cure Time 2.00 min
@Temperature 175 °C
 3.00 min
@Temperature 150 °C
 10.0 sec
@Temperature 200 °C
Shelf Life 3.00 MonthAt 5°C
 12.0 Month
@Temperature -40.0 °C
 
Descriptive Properties
Device Shear grams 2000Thick Film Resistors
Weight Loss % 0.33At 250°C
Working Life months3At 25°C

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PTRAC152 / 71080

Metal adhesives

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