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Chemically Resistant adhesives

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Aptek DAT-A-THERM 1000 Electrically insulating urethane film
Categories: Polymer; Adhesive; Film; Thermoset; Polyurethane, TS; Thermoset Polyurethane, Adhesive

Material Notes: DAT-A-THERM 1000 is a tough, flexible, void free, electrically insulating urethane film designed to fill air gaps and dissipate heat between devices and substrates. DAT-A-THERM 1000 film is a 100% solid, fully crosslinked (C-staged), thermoset urethane polymer, which will not outgas, while in place and is suitable for high vacuum environments. The film exhibits outstanding reversion resistance and physical stability under long-term aging of high humidity and heat. The ultimate in thermal conductivity and overall performance can be achieved by bonding DAT-A-THERM 1000 film to device and conductivity and overall performance can be achieved by bonding DAT-A-THERM 1000 film to device and substrate with DIS-A-PASTE 2000A/B and 2001 PMF thermally conductive urethane adhesives. Both film and adhesive system are compatible in resin and filler technologies and have been designed to be used together.

Uniform filler distribution for consistent thermal dissipation capability throughput film segment; Controlled manufacturing process for a void free film; Low modulus/high elongation for minimum stress buildup under components; Low Tg-remains flexible to -70ºC; Exceeds NASA outgassing requirements for high vacuum environments; Typical film thicknesses, 0.004 to 0.006 in. Custom thicknesses available; Available in sheet or die-cut forms

Information provided by Aptek Laboratories, Inc.

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Physical PropertiesOriginal ValueComments
Density 1.96 g/ccASTM D1475
Moisture Absorption at Equilibrium 0.15 %Cured property; ASTM D570
Outgassing - Total Mass Loss 0.17 %Cured property at 125ºC at 10E-6 torr
Collected Volatile Condensable Material 0.010 %Cured property at 125ºC; at 10E-6 torr
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength, Ultimate 1050 psi
@Thickness 0.127 mm
Cured; ASTM D638
Elongation at Break 75 %
@Thickness 0.127 mm
Cured; ASTM D638
Tensile Modulus 2000 psi
@Thickness 0.127 mm
Cured; ASTM D638
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 7.00e+14 ohm-cmCured property; ASTM D257
Dielectric Constant 5.8
@Frequency 1000 Hz
Cured property; ASTM D150
Dielectric Strength 1000 V/mil
@Thickness 0.127 mm
Cured; ASTM D149
Dissipation Factor 0.030
@Frequency 1000 Hz
Cured property; ASTM D150
 
Thermal PropertiesOriginal ValueComments
CTE, linear 1.00 µm/m-°C
@Temperature 20.0 °C
Cured property; alpha 1
 147 µm/m-°C
@Temperature 20.0 °C
Cured property; alpha 2
Thermal Conductivity 0.00230 cal cm/sec-cm²-°C
Glass Transition Temp, Tg -70.0 °CCured property; JMTP P-100

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

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PAPTEK19 / 24181

Chemically Resistant adhesives

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