LORD CoolTherm™ EP-6037/6252 epoxy system is a two-component epoxy system primarily used by the semiconductor industry to form thermally conductive joints in fabricated heat sinks and between heat sinks and power devices. CoolTherm EP-6037/6252 epoxy system can also be used for bonding semiconductors and transistors to heat sinks, and for general purpose bonding of electronic components. Features: exhibits low shrinkage and stress on components as it cures. provides a strong adhesion bond to a wide variety of substrates. minimizes the possibility of cracking during severe temperature cycling. All information provided by Lord. |