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Ensinger SPI

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Ensinger TECASINT 1011 Polyimide (PI)
Categories: Polymer; Thermoplastic; Polyimide, Thermoplastic

Material Notes: TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excellent wear resistance among other things. The TECASINT 2000 series offers these enhanced thermal properties along with lower moisture absorption, a higher degree of toughness, and better machining properties. TECASINT 2011 is unfilled, while TECASINT 2021 contains 15% graphite which offer improved wear resistance and a lower coefficient of friction. TECASINT 2000 series with their superior physical properties, are ideal for application in the aerospace, nuclear, automotive, electrical/electronics, and chemical processing industries.
    Main Features
  • High thermal and mechanical capacity
  • Good radiation-resistance
  • Broad chemical compatibility
  • Easily machined to tight tolerances
  • Very good electrical insulation
  • Very creep resistant
  • Low outgassing
  • Wear-resistant
  • Sensitive to hydrolysis in higher thermal range
  • Flame retardant according to UL94 V-0

    Applications
  • Cryogenics
  • Electrical engineering
  • Precision engineering
  • Mechanical engineering
  • Nuclear and vacuum technology
  • Semiconductor technology
  • Electronics
  • Aircraft and aerospace industries
  • Food technology

Preferred Fields

Insulators, switch parts, valve faces, friction rings, chain guides, gripper finger for hot glass, sole plate, wear parts

Information Provided by Ensinger, Inc.

Vendors: Ensinger High Performance Plastics withstand severe environments, resist harsh chemicals, and perform well in extreme temperatures. They offer weight savings that have potential to drive lower cost systems.

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Physical PropertiesOriginal ValueComments
Density 1.34 g/cc
@Temperature 23.0 °C
DIN 53 479
Water Absorption 1.08 %
@Temperature 23.0 °C,
Time 86400 sec
EN ISO 62
 3.29 %
@Temperature 80.0 °C,
Time 86400 sec
EN ISO 62
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 90
@Temperature 23.0 °C
DIN 53 505
Tensile Strength, Yield 116 MPa
@Temperature 23.0 °C
EN ISO 527
Elongation at Break 9.0 %
@Temperature 23.0 °C
EN ISO 527
Tensile Modulus 4000 MPa
@Temperature 23.0 °C
EN ISO 527
Flexural Strength 210 MPa
@Temperature 23.0 °C
EN ISO 178
Flexural Modulus 3448 MPa
@Temperature 23.0 °C
EN ISO 178
Flexural Strain at Yield 7.3 %EN ISO 178
Compressive Yield Strength 240 MPa10% Strain; EN ISO 604
Compressive Strength 556 MPa
@Temperature 23.0 °C
EN ISO 604
Compressive Modulus 4000 MPa
@Temperature 23.0 °C
EN ISO 604
Charpy Impact Unnotched 7.58 J/cm²EN ISO 179
Charpy Impact, Notched 0.330 J/cm²
@Temperature 23.0 °C
EN ISO 179
Compression Set 45 %Compression at Break; EN ISO 604
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+17 ohm-cm
@Temperature 23.0 °C
IEC 60093
Surface Resistance 1.00e+16 ohm
@Temperature 23.0 °C
IEC 60093
Dielectric Constant 3.1
@Frequency 2.70e+7 Hz,
Temperature 23.0 °C
IEC 60250
 3.5
@Frequency 50 Hz,
Temperature 23.0 °C
IEC 60250
Dielectric Strength 20.0 kV/mm
@Temperature 23.0 °C
DC; ISO 60243-1
Dissipation Factor 0.0010
@Frequency 50 Hz,
Temperature 23.0 °C
DIN 53 483
 0.0030
@Frequency 2.70e+7 Hz,
Temperature 23.0 °C
DIN 53 483
 
Thermal PropertiesOriginal ValueComments
CTE, linear 43.0 µm/m-°C
@Temperature 50.0 - 200 °C
DIN 53 752
 53.0 µm/m-°C
@Temperature 200 - 300 °C
DIN 53 752
CTE, linear, Transverse to Flow 43.0 µm/m-°C
@Temperature 50.0 - 200 °C
DIN 53 752
 53.0 µm/m-°C
@Temperature 200 - 300 °C
DIN 53 752
Specific Heat Capacity 1.04 J/g-°C
Thermal Conductivity 0.220 W/m-K
@Temperature 40.0 °C
ISO 8302
Maximum Service Temperature, Air 300 °C
Deflection Temperature at 1.8 MPa (264 psi) 368 °CDIN 53 461
Glass Transition Temp, Tg 368 °CDMTA
Flammability, UL94 V-0
 
Descriptive Properties
ColorBlack
DIN-AbbreviationPI

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