| Alloy especially suited to applications in electronics and electro technology. This doped copper, displays high electrical and thermal conductivity, good mechanical properties and excellent temperature stability. CUPROFOR® is used in the manufacture of high power transistor supports, integrated circuits, electrical contacts and shunts. Applications: Electronics Heat sinks for power transistors CUPROFOR® properties include - Thermal conductivity to dissipate heat
- Temperature resistance permitting Pb/Sn soldering of the chip without loss of mechanical properties
- Mechanical strength to prevent deformation of heat dissipaters when moulding. CUPROFOR® can play an important part in the manufacture of power transistor heat sinks.
For this application, CLAL offer 1/2 hard profile strips (condition TL2) in long length coils which can be delivered : - totally or partially Ni coated, with an inlay of Pb/Sn, Ag or other material.
Support media for printed circuits This application uses the following properties : - temperature resistance, thus permitting the soldering of the integrated circuit of the DIE PAD, without loss of hardness in the support media
- Outstanding mechanical properties which guarantees the mechanical strength of the LEADS
- A high deformation capacity gives suitability to form external LEADS.
For this application, CLAL, upon request offer long length tapes :- a high standard of geometrical and dimensional accuracy
- a stress relieving treatment to maintain that the LEADS TIPS are coplanar about the DIE PAD.
The electro-technical field - Electrical contacts
- Contact mounts
- Pushbuttons
- Conductive parts
- Electrical connections and terminals.
Other fields- Heat exchangers
- Seals and washers
- Dephasing rings.
Information provided by CLAL-MSX |
