| TRA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive components to printed circuit boards. This two-part adhesive develops strong, durable, high- impact bonds at room temperature that improve heat transfer while maintaining electrical insulation. TRA-BOND 2156 bonds readily to itself and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and to many other materials, and its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range. Fully cured TRA-BOND 2156 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol. Information provided by Tra-Con Inc. |
