This material is an epoxy molding compound optimized specifically for PBGA applications. It is a reduced catalyst version of SMT-B-1F and provides a 1-2% wire sweep improvement in most applications. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for PBGA applications. Features: - Faster cure speed
- Improved wire sweep performance
- Improved warp performance
- High HSTL performance
- Lower viscosity
- Reduced cure time
Information provided by Cookson Electronics |