Epoxy Technology EPO-TEK® 920-FL Thermally Conductive Epoxy

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Epoxy Technology EPO-TEK® 920-FL Thermally Conductive Epoxy
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes:	Product Description: EPO-TEK® 920-FL is a two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It is a low viscosity version of EPO-TEK® 920. Advantages & Application Notes: It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound. Rheology allows for a smooth free flowing paste, which allows ease of use for potting and casting applications, as well as syringe dispensing. Built-in color change from tan to an amber color. Suggested Applications: Hybrids: thermal potting compound; potting connectors and potting transformers, mounting heat sinks to SMDs and ceramic circuits; potting, glob top protection over SMDs. PCB Level: heat sinking adhesive; adhesion to Au, Cu, Al, FR4, many plastics, components and connectors. Semiconductor: thermal management as semiconductor underfill or glob top encapsulant; potting IC packages like BGAs or CSPs. Available in many intermediate viscosity ranges. Low temperature curing < 120°C. Information Provided by Epoxy Technology
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Physical Properties	Original Value	Comments

Specific Gravity	1.02 g/cc	Part B
	2.52 g/cc	Part A
Particle Size	<= 50 µm
Viscosity	8000 - 12000 cP @Temperature 23.0 °C	20 rpm

Mechanical Properties	Original Value	Comments
Hardness, Shore D	93
Tensile Modulus	783000 psi	Storage
Shear Strength	>= 2000 psi	Lap
	>= 6800 psi	Die

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 4.00e+13 ohm-cm
Dielectric Constant	5.93 @Frequency 1000 Hz
Dissipation Factor	0.0090 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	21.0 µm/m-°C	Below Tg
	97.0 µm/m-°C	Above Tg
Thermal Conductivity	0.890 W/m-K
Maximum Service Temperature, Air	200 °C	Continuous
	300 °C	Intermittent
Minimum Service Temperature, Air	-55.0 °C	Continuous
	-55.0 °C	Intermittent
Glass Transition Temp, Tg	>= 90.0 °C	Dynamic Cure 20200°C /ISO 25 Min; Ramp -40200°C @ 20°C/Min
Decomposition Temperature	362 °C	Degradation Temperature

Processing Properties	Original Value	Comments
Cure Time	5.00 min @Temperature 150 °C	Minimum Bond Line
	10.0 min @Temperature 120 °C	Minimum Bond Line
	20.0 min @Temperature 100 °C	Minimum Bond Line
Pot Life	420 min
Shelf Life	12.0 Month @Temperature 25.0 °C

Descriptive Properties
Color	Amber	Part B
	Grey	Part A
Consistency	Smooth flowing paste
Mix Ratio by Weight	100:3
Number of Components	Two
Thixotropic Index	3.1
Weight Loss	0.2%	200°C
	0.28%	250°C
	0.48%	300°C

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PPOXYT054 / 141093

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