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Master Bond adhesives

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KEP Kepital® F40 Standard Grade/Low Viscosity Acetal Homopolymer
Categories: Polymer; Thermoplastic; Acetal (Polyoxymethylene, POM); Acetal Homopolymer, Unreinforced

Material Notes: injection molding: electrical parts, machine/mechanical parts, industrial parts, automotive applications, electronic data processing.

Kepital® is a registered trademark of Korea Engineering Plastics Co., Ltd. Information provided by Dayson Polymers.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 1.41 g/ccASTM D792
Water Absorption 0.22 %24 hrs.; ASTM D570
Linear Mold Shrinkage, Flow 0.020 cm/cmASTM D955
Melt Flow 45 g/10 minASTM D1238
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell M 80ASTM D785
Tensile Strength at Break 9020 psiASTM D638
Elongation at Break 45 %
Flexural Yield Strength 12800 psiASTM D790
Flexural Modulus 379400 psiASTM D790
Izod Impact, Notched 0.920 ft-lb/in0.126 inches; ASTM D256
Tensile Impact Strength 46.7 ft-lb/in²0.0630 in; ASTM D1822
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+14 ohm-cmASTM D257
Surface Resistance 1.00e+16 ohmASTM D257
Dielectric Constant 3.7
@Frequency 1e+6 Hz
ASTM D150
Dielectric Strength 483 V/milASTM D149
Dissipation Factor 0.0070
@Frequency 1e+6 Hz
ASTM D150
 
Thermal PropertiesOriginal ValueComments
CTE, linear, Parallel to Flow 72.0 µin/in-°F
@Temperature 20.0 °C
ASTM D696
Melting Point 329 °F
Deflection Temperature at 0.46 MPa (66 psi) 316 °FUnannealed; ASTM D648
Deflection Temperature at 1.8 MPa (264 psi) 230 °FUnannealed; ASTM D648
Flammability, UL94 HB
@Thickness 0.800 mm
 HB
@Thickness 6.40 mm

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