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Metal adhesives

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Aptek 2712-A/B Very low stress silicone adhesive
Categories: Polymer; Adhesive; Thermoset; Silicone; Silicone, RTV, Adhesive/Sealant Grade

Material Notes: Very low stress silicone adhesive; -110ºC to 260ºC operating range; Low outgassing/space grade
APTEK 2712-A/B is a two component, white, very soft, thixotropic, electrically insulative, silicone adhesive displaying excellent flow temperature flexibility and unusually high physical strength properties. APTEK 2712-A/B has been designed to fully cure at room temperature and can be accelerated with a brief low temperature cure. This 100% solid system has been manufactured with highly pure resins to minimize the occurrence of ionic contamination without outgassing during cure or service.

Very flexible/low modulus over wide temperature range to absorb stress build-up during thermal cycling; Convenient 1:1 PBW or PBV mix ratio for easy handling-ideal for cartridge dispensers/repair kits; Very good adhesion to various substrates when used in conjunction with APTEK P-107 primer; Long work life, short cure cycle options for improved productivity on large area bonding applications.

APTEK 2712A is a white silica-filled silicone resin blend. APTEK 2712B is a translucent silica-filled silicone resin blend.

Information provided by Aptek Laboratories, Inc.

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Physical PropertiesOriginal ValueComments
Density 1.15 g/ccA Component; ASTM D1475
 1.15 g/ccB Component; ASTM D1475
Outgassing - Total Mass Loss 0.55 %at 10E-6 torr; ASTM E595
Collected Volatile Condensable Material 0.050 %at 10E-6 torr; ASTM E595
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 16Cured property; ASTM D2240
Tensile Strength, Ultimate 600 psi
@Thickness 1.47 mm
Cured; ASTM D638
Elongation at Break 700 %Cured property; ASTM D638
Adhesive Bond Strength 400 psiAl-to-Al Lap Shear; Cured property;5 mil bondline thickness on primed aluminum panels; ASTM D1002
Tear Strength 135 pliASTM D624
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+15 ohm-cmCured property; ASTM D257
Dielectric Strength 350 V/mil
@Thickness 6.35 mm
Cured; ASTM D149
 
Thermal PropertiesOriginal ValueComments
CTE, linear 54.0 µm/m-°C
@Temperature 20.0 °C
Cured property; alpha 1
 235 µm/m-°C
@Temperature 20.0 °C
Cured property; alpha 2
Maximum Service Temperature, Air 260 °C
Minimum Service Temperature, Air -110 °C
Glass Transition Temp, Tg -110 °CCured property; Perkin Elmer TMS-2
Flash Point >= 150 °CA Component; ASTM D92
 >= 150 °CB Component; ASTM D92
 
Processing PropertiesOriginal ValueComments
Processing Temperature 25.0 °CCure Time not defined
 65.0 °CCure 1 hrs
 100 °CCure 0.5 hrs.

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PAPTEK07 / 24169

Metal adhesives

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