Henkel Loctite® ABLESTIK QMI2569 Silver Glass

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Henkel Loctite® ABLESTIK QMI2569 Silver Glass
Categories:	Ceramic; Glass
Material Notes:	Appearance: Silver paste Cure: Firing Product Benefits Void-free bondline Maximum thermal dissipation Application: Semiconductor, Conductive Adhesive Typical Package Application: Hermetic packages LOCTITE ABLESTIK QMI2569 is a silver glass die attach adhesive used for attachment of integrated circuits in both solder seal glass seal hermetic packages. The material allows for simultaneous processing of die attach and leadframe embedding, while producing a void-free bondline for maximum thermal dissipation. Excellent RGA moisture results are acquired through the use of lead borate glass. The LOCTITE ABLESTIK QMI2569 also offers improved processability by allowing in-line drying during the firing process on die as large as 0.800" x 0.800". Either multi-needle or starfish can be used to apply the material. LOCTITE ABLESTIK QMI2569 can only be used in hermetic packaging applications. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Filler Content	70 %	Silver
Viscosity	35800 cP	Uncured, Speed 10 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	15100 MPa	Cured, DMA
Peel Strength	>= 100 pli	Tensile Adhesion, 500 mil X 500 mil die at 25°C, Si die to Au plated ceramic

Electrical Properties	Original Value	Comments
Volume Resistivity	<= 15 ohm-cm	Cured

Thermal Properties	Original Value	Comments
CTE, linear	16.0 µm/m-°C	Cured, alpha1
Thermal Conductivity	>= 60.0 W/m-K	Cured
Glass Transition Temp, Tg	250 °C	Cured

Processing Properties	Original Value	Comments
Shelf Life	12.0 Month	Uncured

Descriptive Properties
Extractable Ionic Content (ppm)	<10	Cured, Chloride (Cl-)
	<10	Cured, Fluoride (F-)
	<20	Cured, Sodium (Na+)
	<20	Cured, Potassium (K+)
Thixotropic Index	8	Uncured, 1/20 rpm

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PLOCT5065 / 255276

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