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Ensinger PEI

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Parker Chomerics CHO-BOND® 4669 Conductive Caulk/Sealant
Categories: Polymer; Adhesive; Thermoset

Material Notes: Chomerics two-component conductive epoxy caulks provide excellent adhesion to dissimilar substrates and can be used in lap or butt joint applications. They feature large silver-plated-copper particles that make them well suited for sealing poorly toleranced surfaces.

Information provided by Chomerics

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.70 - 2.30 g/cc
Volatile Organic Compounds (VOC) Content 361 g/l
Volatiles 10 - 20 %
Thickness >= 15.0 mil
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity <= 0.080 ohm-cm
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 100 °C
Minimum Service Temperature, Air -55.0 °C
Flash Point >= 84.0 °F
 
Processing PropertiesOriginal ValueComments
Cure Time 168 hour
@Temperature 23.0 °C
Shelf Life 6.00 Month
 
Component Elements PropertiesOriginal ValueComments
Copper, Cu <= 60 %
Silver, Ag <= 10 %
 
Descriptive Properties
Amorphous fumed silica wt. % Max5
BinderPolyisobutylene
ColorGray/silver
ConsistencyGritty Paste
Coverage (cm^2 / g)12.8
Ethyl Benzene wt. %4
FillerAg/Cu
Mix Ratio1-part
Physical FormGray/silver liquid with a solvent odor
Polyisobutylene wt. % Max20
Working Life hr.2.5
Xylene wt. %10-20

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