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USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

SABIC ULTEM™ Resin HU2200 Polyetherimide (PEI)
Categories: Polymer; Thermoplastic; Polyetherimide (PEI)

Material Notes: 20% Glass fiber filled, enhanced flow Polyetherimide (Tg 217C). ECO Conforming. For medical devices and pharmaceutical applications. Healthcare management of change, biocompatible (ISO 10993 or USP Class VI); food contact compliant; Steam, Gamma, EtO, and E-beam sterilizable.

Features: Healthcare,High Stiffness,Steam, Gamma, EtO and E-beam sterilizable,Hydrolytic Stability,Chemical Resistance,Low Smoke and Toxicity,Good Mechanicals in Broad Temperature Range,Low Creep Sensitivity,Low Shrinkage,Good metal adhesion,Amorphous,High Strength,High Heat Resistance,Good dimensional stability,Flame Retardant,Steam Sterilizable,Gamma Sterilizable,E-beam Sterilizable,Food Contact Acceptable,Biocompatible

Information provided by SABIC

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.42 g/cc1.42 g/ccASTM D792
Density 1.42 g/cc0.0513 lb/in³ISO 1183
Moisture Absorption 0.0200 %0.0200 %Injection Molding
 0.550 %0.550 %23°C / 50% RH; ISO 62
Water Absorption at Saturation 1.0 %1.0 %ISO 62-1
Viscosity 7.0 cP
@Load 5.00 kg,
Temperature 360 °C
7.0 cP
@Load 11.0 lb,
Temperature 680 °F
MVR cc/10 min; ISO 1133
Linear Mold Shrinkage, Flow 0.0030 - 0.0050 cm/cm
@Thickness 3.20 mm
0.0030 - 0.0050 in/in
@Thickness 0.126 in
SABIC method
Melt Flow 6.0 g/10 min
@Load 6.60 kg,
Temperature 337 °C
6.0 g/10 min
@Load 14.6 lb,
Temperature 639 °F
ASTM D1238
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength at Break 131 MPa19000 psi5 mm/min; ASTM D638
 131 MPa19000 psi5 mm/min; ISO 527
Tensile Strength, Yield 131 MPa19000 psi5 mm/min; ASTM D638
 131 MPa19000 psi5 mm/min; ISO 527
Elongation at Break 4.0 %4.0 %5 mm/min; ASTM D638
 4.0 %4.0 %5 mm/min; ISO 527
Elongation at Yield 4.0 %4.0 %5 mm/min; ASTM D638
 4.0 %4.0 %5 mm/min; ISO 527
Tensile Modulus 6.89 GPa999 ksi5 mm/min; ASTM D638
 6.89 GPa999 ksi1 mm/min; ISO 527
Flexural Strength 225 MPa32600 psiyld, 1.3 mm/min, 50 mm span; ASTM D790
 228 MPa33100 psiyield, 2 mm/min; ISO 178
Flexural Modulus 6.85 GPa994 ksi1.3 mm/min, 50 mm span; ASTM D790
 6.89 GPa999 ksi2 mm/min; ISO 178
Izod Impact Notched 64.0 J47.2 ft-lbASTM D256
 70.0 J
@Temperature -30.0 °C
51.6 ft-lb
@Temperature -22.0 °F
ASTM D256
Izod Impact, Unnotched 4.80 J/cm8.99 ft-lb/inASTM D4812
Izod Impact, Notched (ISO) 64.0 kJ/m²30.5 ft-lb/in²80*10*4; ISO 180/1A
 70.0 kJ/m²
@Temperature -30.0 °C
33.3 ft-lb/in²
@Temperature -22.0 °F
80*10*4; ISO 180/1A
Charpy Impact, Notched 6.50 J/cm²30.9 ft-lb/in²Edgew 80*10*4 sp=62mm; ISO 179/1eA
Dart Drop, Total Energy 8.00 J5.90 ft-lbASTM D3763
 
Electrical PropertiesMetricEnglishComments
Arc Resistance 60 - 120 sec60 - 120 secASTM D495
Comparative Tracking Index 100 - 175 V100 - 175 VUL 746A
Hot Wire Ignition, HWI  30 - 60 sec
@Thickness >=1.50 mm
30 - 60 sec
@Thickness >=0.0591 in
UL 746A
 60 - 120 sec
@Thickness >=3.00 mm
60 - 120 sec
@Thickness >=0.118 in
UL 746A
High Amp Arc Ignition, HAI  0.00 - 15 arcs
@Thickness >=3.00 mm
0.00 - 15 arcs
@Thickness >=0.118 in
UL 746A
 15 - 30 arcs
@Thickness >=1.50 mm
15 - 30 arcs
@Thickness >=0.0591 in
UL 746A
High Voltage Arc-Tracking Rate, HVTR 25.4 - 80.0 mm/min1.00 - 3.15 in/minUL 746A
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow  25.0 µm/m-°C
@Temperature -20.0 - 150 °C
13.9 µin/in-°F
@Temperature -4.00 - 302 °F
ASTM E831
 25.0 µm/m-°C
@Temperature 23.0 - 150 °C
13.9 µin/in-°F
@Temperature 73.4 - 302 °F
ISO 11359-2
CTE, linear, Transverse to Flow  50.0 µm/m-°C
@Temperature -40.0 - 150 °C
27.8 µin/in-°F
@Temperature -40.0 - 302 °F
ASTM E831
 50.0 µm/m-°C
@Temperature 23.0 - 150 °C
27.8 µin/in-°F
@Temperature 73.4 - 302 °F
ISO 11359-2
Deflection Temperature at 1.8 MPa (264 psi) 205 °C401 °FEdgew 120*10*4 sp=100mm; ISO 75/Ae
 208 °C
@Thickness 3.20 mm
406 °F
@Thickness 0.126 in
unannealed; ASTM D648
Vicat Softening Point 212 °C414 °FRate B/50; ISO 306
 218 °C424 °FRate B/120; ISO 306
 220 °C428 °FRate B/50; ASTM D1525
UL RTI, Electrical 170 °C338 °FUL 746B
UL RTI, Mechanical with Impact 170 °C338 °FUL 746B
UL RTI, Mechanical without Impact 170 °C338 °FUL 746B
Flammability, UL94  V-0
@Thickness >=0.410 mm
V-0
@Thickness >=0.0161 in
UL 94
 5VA
@Thickness >=1.90 mm
5VA
@Thickness >=0.0748 in
UL 94
 
Processing PropertiesMetricEnglishComments
Nozzle Temperature 345 - 400 °C653 - 752 °F
Zone 2 340 - 400 °C644 - 752 °F
Zone 3 345 - 400 °C653 - 752 °F
Melt Temperature 350 - 400 °C662 - 752 °FInjection Molding
Mold Temperature 135 - 165 °C275 - 329 °F
Drying Temperature 150 °C302 °FInjection Molding
Dry Time 4.00 - 6.00 hour4.00 - 6.00 hourInjection Molding
 24.0 hour24.0 hourCumulative; Injection Molding
Back Pressure 0.300 - 0.700 MPa43.5 - 102 psi
Shot Size 40 - 60 %40 - 60 %
Vent Depth 0.00250 - 0.00760 cm0.000984 - 0.00299 in
Screw Speed 40 - 70 rpm40 - 70 rpm

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PSABH82726 / 290673

Ensinger SPI

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