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Elmet Technologies

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Kohesi Bond KB 16842 HT Two component, low viscosity, room temperature curing epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Product Highlights:
  • Excellent resistance to high temperatures
  • Conforms to FDA 175.105 standards
  • Forgiving mix ratio
  • Outstanding electrical insulation properties
  • Exceptional physical strength properties
  • Stellar dimensional stability
Kohesi Bond KB 16842 HT is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has an easy 100:50 (Part A: Part B) mix ratio by weight or volume. KB 16842 HT can be used for indirect food contact applications as per the 175.105 FDA specification. This epoxy system can be adjusted to your hardness requirements by varying its mix ratio. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C-90°C for 3-5 hours. KB 16842 HT offers an extensive service temperature range of -50°C to +200°C. It has outstanding physical strength properties as well as dimensional stability. It offers minimal shrinkage upon cure. KB 16842 HT adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation. Part A is clear in color and Part B is amber in color. This product is available in a variety of colors and can be color matched to your specifications. KB 16842 HT is widely used in electronics, medical, food and specialty OEM industries.

Typical Applications:

  • Bonding
  • Sealing
  • Coating

Information provided by Kohesi Bond Custom Engineered Adhesives

Vendors: Kohesi Bond is a pioneer in manufacturing over 300 grades of custom engineered adhesives, sealants, coatings, potting and encapsulation compounds. Our first-rate adhesives are tailor-fitted to meet your exact specifications and offer superior strength and performance in your application. Learn more about Kohesi Bond’s industry-ready products at kohesibond.com.

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Physical PropertiesOriginal ValueComments
Density 0.970 g/ccPart B
 1.22 g/ccPart A
Viscosity 11000 - 15000 cPPart B
 25000 - 85000 cPMixed
 60000 - 110000 cPPart A
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D >= 75
Tensile Strength >= 9200 psi
Tensile Modulus >= 360000 psi
Adhesive Bond Strength >= 3100 psiTensile Lap Shear, Al/Al
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+15 ohm-cm
Dielectric Constant 3.89
@Frequency 60 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 80.0 - 100 µm/m-°C
Maximum Service Temperature, Air 200 °C
Minimum Service Temperature, Air -50.0 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 2.00 - 3.00 hour
@Temperature 90.0 °C
Option 2
 3.00 - 5.00 hour
@Temperature 70.0 - 90.0 °C
Optimum Cure: overnight at 23°C plus 3 - 5 hours at 70°C - 90°C
 24.0 - 48.0 hour
@Temperature 23.0 °C
Option 1
Working Life 60.0 - 90.0 min100 g of mixed epoxy
Shelf Life 12.0 Monthin original unopened containers

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PKOHESI974 / 249153

Ensinger PEI

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